DTA144W ON Semiconductor, DTA144W Datasheet - Page 8

• Manufacturer Part Number: DTA144W
• Description: Bias Resistor Transistor
• Manufacturer: ON Semiconductor

MUN2111T1 SERIES
design. The footprint for the semiconductor packages must
be the correct size to insure proper solder connection
size. This can vary from the minimum pad size for soldering
to the pad size given for maximum power dissipation. Power
dissipation for a surface mount device is determined by
T J(max) , the maximum rated junction temperature of the die,
R JA , the thermal resistance from the device junction to
ambient; and the operating temperature, T A . Using the
values provided on the data sheet, P D can be calculated as
follows:
ratings table on the data sheet. Substituting these values into
temperature of the device. When the entire device is heated
to a high temperature, failure to complete soldering within a
short time could result in device failure. Therefore, the
following items should always be observed in order to
minimize the thermal stress to which the devices are
subjected.
8
Surface mount board layout is a critical portion of the total
The power dissipation of the SC–59 is a function of the pad
The values for the equation are found in the maximum
The melting temperature of solder is higher than the rated
Always preheat the device.
The delta temperature between the preheat and
soldering should be 100 C or less.*
When preheating and soldering, the temperature of the
leads and the case must not exceed the maximum
temperature ratings as shown on the data sheet. When
using infrared heating with the reflow soldering method,
the difference should be a maximum of 10 C.
MINIMUM RECOMMENDED FOOTPRINT FOR SURFACE MOUNTED APPLICATIONS
P D =
T J(max) – T A
R JA
0.037
0.95
0.039
1.0
SC–59 POWER DISSIPATION
SOLDERING PRECAUTIONS
0.031
0.8
Motorola Small–Signal Transistors, FETs and Diodes Device Data
interface between the board and the package. With the
correct pad geometry, the packages will self align when
subjected to a solder reflow process.
the equation for an ambient temperature T A of 25 C, one can
calculate the power dissipation of the device which in this
case is 200 milliwatts.
footprint on a glass epoxy printed circuit board to achieve a
power dissipation of 200 milliwatts. Another alternative would
be to use a ceramic substrate or an aluminum core board
such as Thermal Clad . Using a board material such as
Thermal Clad, a power dissipation of 400 milliwatts can be
achieved using the same footprint.
* Soldering a device without preheating can cause excessive
thermal shock and stress which can result in damage to the
device.
The 625 C/W assumes the use of the recommended
The soldering temperature and time should not exceed
260 C for more than 10 seconds.
When shifting from preheating to soldering, the
maximum temperature gradient should be 5 C or less.
After soldering has been completed, the device should
be allowed to cool naturally for at least three minutes.
Gradual cooling should be used as the use of forced
cooling will increase the temperature gradient and result
in latent failure due to mechanical stress.
Mechanical stress or shock should not be applied during
cooling
0.094
2.4
0.037
0.95
0.098–0.118
inches
2.5–3.0
mm
P D =
150 C – 25 C
625 C/W
= 200 milliwatts