MC14490 ON Semiconductor, MC14490 Datasheet - Page 10

• Manufacturer Part Number: MC14490
• Description: Hex Contact Bounce Eliminator
• Manufacturer: ON Semiconductor

e
16
1
0.13 (0.005)
Z
b
D
M
9
8
A
E
0.10 (0.004)
A
H
1
E
VIEW P
PLASTIC EIAJ SOIC PACKAGE
PACKAGE DIMENSIONS
M
_
L
http://onsemi.com
E
CASE 966–01
SOEIAJ–16
MC14490
F SUFFIX
ISSUE O
L
DETAIL P
10
Q
1
c
NOTES:
1.
2.
3.
4.
5.
Y14.5M, 1982.
MOLD FLASH OR PROTRUSIONS AND ARE
MEASURED AT THE PARTING LINE. MOLD FLASH
OR PROTRUSIONS SHALL NOT EXCEED 0.15
(0.006) PER SIDE.
REFERENCE ONLY.
INCLUDE DAMBAR PROTRUSION. ALLOWABLE
DAMBAR PROTRUSION SHALL BE 0.08 (0.003)
TOTAL IN EXCESS OF THE LEAD WIDTH
DIMENSION AT MAXIMUM MATERIAL CONDITION.
DAMBAR CANNOT BE LOCATED ON THE LOWER
RADIUS OR THE FOOT. MINIMUM SPACE
BETWEEN PROTRUSIONS AND ADJACENT LEAD
TO BE 0.46 ( 0.018).
DIM
H
A
A
D
E
L
M
b
c
e
L
Q
Z
1
E
E
DIMENSIONING AND TOLERANCING PER ANSI
CONTROLLING DIMENSION: MILLIMETER.
DIMENSIONS D AND E DO NOT INCLUDE
TERMINAL NUMBERS ARE SHOWN FOR
THE LEAD WIDTH DIMENSION (b) DOES NOT
1
MILLIMETERS
MIN
0.05
0.35
0.18
9.90
5.10
7.40
0.50
0.70
1.10
–––
–––
0
1.27 BSC
_
10.50
MAX
10
2.05
0.20
0.50
0.27
5.45
8.20
0.85
1.50
0.90
0.78
_
0.002
0.014
0.007
0.390
0.201
0.291
0.020
0.043
0.028
MIN
–––
–––
0.050 BSC
0
INCHES
_
0.081
0.008
0.020
0.413
0.215
0.323
0.033
0.059
0.035
0.031
MAX
0.011
10
_