MC10H330 ON Semiconductor, MC10H330 Datasheet - Page 4

• Manufacturer Part Number: MC10H330
• Description: Quad Bus Driver/Receiver with 2-to-1 Output Multiplexers
• Manufacturer: ON Semiconductor

−L−
C
0.010 (0.250)
28
Z
G1
S
G
T
1
−N−
L−M
S
NOTES:
V
1. DATUMS −L−, −M−, AND −N− DETERMINED
2. DIMENSION G1, TRUE POSITION TO BE
3. DIMENSIONS R AND U DO NOT INCLUDE
4. DIMENSIONING AND TOLERANCING PER
5. CONTROLLING DIMENSION: INCH.
6. THE PACKAGE TOP MAY BE SMALLER THAN
7. DIMENSION H DOES NOT INCLUDE DAMBAR
N
WHERE TOP OF LEAD SHOULDER EXITS
PLASTIC BODY AT MOLD PARTING LINE.
MEASURED AT DATUM −T−, SEATING PLANE.
MOLD FLASH. ALLOWABLE MOLD FLASH IS
0.010 (0.250) PER SIDE.
ANSI Y14.5M, 1982.
THE PACKAGE BOTTOM BY UP TO 0.012
(0.300). DIMENSIONS R AND U ARE
DETERMINED AT THE OUTERMOST
EXTREMES OF THE PLASTIC BODY
EXCLUSIVE OF MOLD FLASH, TIE BAR
BURRS, GATE BURRS AND INTERLEAD
FLASH, BUT INCLUDING ANY MISMATCH
BETWEEN THE TOP AND BOTTOM OF THE
PLASTIC BODY.
PROTRUSION OR INTRUSION. THE DAMBAR
PROTRUSION(S) SHALL NOT CAUSE THE H
DIMENSION TO BE GREATER THAN 0.037
(0.940). THE DAMBAR INTRUSION(S) SHALL
NOT CAUSE THE H DIMENSION TO BE
SMALLER THAN 0.025 (0.635).
A
R
S
J
E
−M−
W
VIEW S
0.007 (0.180)
Y BRK
0.007 (0.180)
D
D
PACKAGE DIMENSIONS
−T−
PLASTIC PLCC PACKAGE
0.004 (0.100)
http://onsemi.com
SEATING
PLANE
M
CASE 776−02
M
FN SUFFIX
PLCC−28
T
ISSUE D
T
L−M
L−M
4
S
S
B
Z
N
N
S
DIM
VIEW D−D
G1
K1
S
W
A
B
C
G
H
K
R
U
E
F
J
V
X
Y
Z
U
X
0.007 (0.180)
K
0.485
0.485
0.165
0.090
0.013
0.026
0.020
0.025
0.450
0.450
0.042
0.042
0.042
0.410
0.040
MIN
−−−
0.050 BSC
2
INCHES
_
0.007 (0.180)
VIEW S
0.495
0.495
0.180
0.019
0.032
0.456
0.456
0.048
0.048
0.056
0.020
0.430
0.110
MAX
−−−
−−−
10
−−−
H
_
M
12.32
12.32
10.42
11.43
11.43
MILLIMETERS
G1
MIN
4.20
2.29
0.33
0.66
0.51
0.64
1.07
1.07
1.07
1.02
−−−
T
1.27 BSC
2
F
_
M
L−M
12.57
12.57
11.58
11.58
10.92
MAX
0.007 (0.180)
T
4.57
2.79
0.48
0.81
1.21
1.21
1.42
0.50
K1
−−−
−−−
10
−−−
S
0.010 (0.250)
_
0.007 (0.180)
L−M
N
S
S
N
M
S
S
M
T
T
T
L−M
L−M
L−M
S
S
S
N
N
N
S
S
S