MC10EP116 ON Semiconductor, MC10EP116 Datasheet - Page 5

• Manufacturer Part Number: MC10EP116
• Description: Hex Differential Line Receiver
• Manufacturer: ON Semiconductor

SEATING
PLANE
9
B
C
–AB–
–AC–
B1
E
–T–
H
8
1
8X
M _
DETAIL AD
32
W
9
S1
A1
G
A
S
0.10 (0.004) AC
DETAIL Y
X
–Z–
25
K
R
4X
17
4X
Q _
32–LEAD PLASTIC PACKAGE
0.20 (0.008)
PACKAGE DIMENSIONS
–U–
0.20 (0.008)
V1
DETAIL AD
http://onsemi.com
V
CASE 873A–02
MC10EP116
FA SUFFIX
AB
ISSUE A
TQFP
AC
T–U
SECTION AE–AE
F
5
É É
É É É É
É É
T–U
METAL
BASE
Z
J
N
Z
D
P
NOTES:
1.
2.
3.
4.
5.
6.
7.
8.
9.
Y14.5M, 1982.
OF LEAD AND IS COINCIDENT WITH THE LEAD
WHERE THE LEAD EXITS THE PLASTIC BODY AT
THE BOTTOM OF THE PARTING LINE.
DETERMINED AT DATUM PLANE –AB–.
SEATING PLANE –AC–.
MOLD PROTRUSION. ALLOWABLE PROTRUSION
IS 0.250 (0.010) PER SIDE. DIMENSIONS A AND B
DO INCLUDE MOLD MISMATCH AND ARE
DETERMINED AT DATUM PLANE –AB–.
PROTRUSION. DAMBAR PROTRUSION SHALL
NOT CAUSE THE D DIMENSION TO EXCEED
0.520 (0.020).
BE 0.0076 (0.0003).
FROM DEPICTION.
DIM
A1
B1
S1
V1
G
M
Q
W
DIMENSIONING AND TOLERANCING PER ANSI
CONTROLLING DIMENSION: MILLIMETER.
DATUM PLANE –AB– IS LOCATED AT BOTTOM
DATUMS –T–, –U–, AND –Z– TO BE
DIMENSIONS S AND V TO BE DETERMINED AT
DIMENSIONS A AND B DO NOT INCLUDE
DIMENSION D DOES NOT INCLUDE DAMBAR
MINIMUM SOLDER PLATE THICKNESS SHALL
EXACT SHAPE OF EACH CORNER MAY VARY
A
B
C
D
E
F
H
J
K
N
P
R
S
V
X
1.400
0.300
1.350
0.300
0.050
0.090
0.500
0.090
0.150
MILLIMETERS
MIN
DETAIL Y
7.000 BSC
3.500 BSC
7.000 BSC
3.500 BSC
0.800 BSC
0.400 BSC
9.000 BSC
4.500 BSC
9.000 BSC
4.500 BSC
0.200 REF
1.000 REF
1
12 REF
_
_
1.600
0.450
1.450
0.400
0.150
0.200
0.700
0.160
0.250
MAX
5
_
0.055
0.012
0.053
0.012
0.002
0.004
0.020
0.004
0.006
MIN
0.031 BSC
0.016 BSC
0.354 BSC
0.177 BSC
0.354 BSC
0.177 BSC
0.276 BSC
0.138 BSC
0.276 BSC
0.138 BSC
0.008 REF
0.039 REF
1
12 REF
INCHES
_
AE
AE
_
MAX
0.063
0.018
0.057
0.016
0.006
0.008
0.028
0.006
0.010
5
_