MC100EP139 ON Semiconductor, MC100EP139 Datasheet - Page 6

• Manufacturer Part Number: MC100EP139
• Description: 2/4 / 4./5/6 Clock Generation Chip
• Manufacturer: ON Semiconductor

0.15 (0.006) T
0.15 (0.006) T
L
–T–
2X
U
PIN 1
IDENT
U
C
0.100 (0.004)
L/2
SEATING
PLANE
S
S
D
20
1
20X
–V–
0.10 (0.004)
A
K
G
REF
20 PIN PLASTIC TSSOP PACKAGE
H
M
PACKAGE DIMENSIONS
10
11
T
U
http://onsemi.com
MC100EP139
CASE 948E–02
–U–
S
B
DT SUFFIX
TSSOP–20
ISSUE A
V
S
J J1
N
6
N
DETAIL E
Í Í Í Í
Í Í Í Í
Í Í Í Í
SECTION N–N
DETAIL E
F
K1
0.25 (0.010)
K
M
–W–
NOTES:
1.
2.
3.
4.
5.
6.
7.
Y14.5M, 1982.
FLASH, PROTRUSIONS OR GATE BURRS. MOLD
FLASH OR GATE BURRS SHALL NOT EXCEED
0.15 (0.006) PER SIDE.
INTERLEAD FLASH OR PROTRUSION.
INTERLEAD FLASH OR PROTRUSION SHALL NOT
EXCEED 0.25 (0.010) PER SIDE.
PROTRUSION. ALLOWABLE DAMBAR
PROTRUSION SHALL BE 0.08 (0.003) TOTAL IN
EXCESS OF THE K DIMENSION AT MAXIMUM
MATERIAL CONDITION.
REFERENCE ONLY.
DETERMINED AT DATUM PLANE –W–.
DIM
J1
K1
G
M
A
B
C
D
F
H
J
K
L
DIMENSIONING AND TOLERANCING PER ANSI
CONTROLLING DIMENSION: MILLIMETER.
DIMENSION A DOES NOT INCLUDE MOLD
DIMENSION B DOES NOT INCLUDE
DIMENSION K DOES NOT INCLUDE DAMBAR
TERMINAL NUMBERS ARE SHOWN FOR
DIMENSION A AND B ARE TO BE
MILLIMETERS
MIN
6.40
4.30
0.05
0.50
0.27
0.09
0.09
0.19
0.19
–––
0
0.65 BSC
6.40 BSC
_
MAX
6.60
4.50
1.20
0.15
0.75
0.37
0.20
0.16
0.30
0.25
8
_
0.252
0.169
0.002
0.020
0.004
0.004
0.007
0.007
0.011
MIN
–––
0.026 BSC
0.252 BSC
0
_
INCHES
MAX
0.260
0.177
0.047
0.006
0.030
0.015
0.008
0.006
0.012
0.010
8
_