MC100E211 ON Semiconductor, MC100E211 Datasheet - Page 6

• Manufacturer Part Number: MC100E211
• Description: 1:6 DIFFERENTIAL CLOCK DISTRIBUTION CHIP
• Manufacturer: ON Semiconductor

MC10E211 MC100E211
MOTOROLA
-L-
C
0.010 (0.250)
28
Z
G1
S
G
T L –M
1
-N-
NOTES:
1. DATUMS -L-, -M-, AND -N- DETERMINED
2. DIM G1, TRUE POSITION TO BE MEASURED
3. DIM R AND U DO NOT INCLUDE MOLD FLASH.
4. DIMENSIONING AND TOLERANCING PER ANSI
5. CONTROLLING DIMENSION: INCH.
6. THE PACKAGE TOP MAY BE SMALLER THAN
7. DIMENSION H DOES NOT INCLUDE DAMBAR
S
V
WHERE TOP OF LEAD SHOULDER EXITS
PLASTIC BODY AT MOLD PARTING LINE.
AT DATUM -T-, SEATING PLANE.
ALLOWABLE MOLD FLASH IS 0.010 (0.250)
PER SIDE.
Y14.5M, 1982.
THE PACKAGE BOTTOM BY UP TO 0.012
(0.300). DIMENSIONS R AND U ARE
DETERMINED AT THE OUTERMOST
EXTREMES OF THE PLASTIC BODY
EXCLUSIVE OF MOLD FLASH, TIE BAR
BURRS, GATE BURRS AND INTERLEAD
FLASH, BUT INCLUDING ANY MISMATCH
BETWEEN THE TOP AND BOTTOM OF THE
PLASTIC BODY.
PROTRUSION OR INTRUSION. THE DAMBAR
PROTRUSION(S) SHALL NOT CAUSE THE H
DIMENSION TO BE GREATER THAN 0.037
(0.940). THE DAMBAR INTRUSION(S) SHALL
NOT CAUSE THE H DIMENSION TO BE
SMALLER THAN 0.025 (0.635).
E
A
N
R
S
-M-
W
VIEW S
J
Y BRK
0.007 (0.180)
0.007 (0.180)
-T-
D
D
OUTLINE DIMENSIONS
PLASTIC PLCC PACKAGE
0.004 (0.100)
SEATING
PLANE
M
M
CASE 776–02
FN SUFFIX
T L –M
T L –M
ISSUE D
2–6
B
S
S
Z
VIEW D-D
N
N
U
S
S
X
DIM
G1
K1
W
A
B
C
E
G
H
K
R
U
V
X
Y
F
J
Z
0.007 (0.180)
K
0.485
0.485
0.165
0.090
0.013
0.026
0.020
0.025
0.450
0.450
0.042
0.042
0.042
0.410
0.040
MIN
2
—
0.050 BSC
0.007 (0.180)
INCHES
VIEW S
0.495
0.495
0.180
0.110
0.019
0.032
0.456
0.456
0.048
0.048
0.056
0.020
0.430
MAX
10
—
—
—
M
G1
F
12.32
12.32
10.42
11.43
11.43
MILLIMETERS
MIN
H
4.20
2.29
0.33
0.66
0.51
0.64
1.07
1.07
1.07
1.02
T L –M
—
2
1.27 BSC
M
K1
12.57
12.57
11.58
11.58
10.92
T L –M
MAX
0.007 (0.180)
4.57
2.79
0.48
0.81
1.21
1.21
1.42
0.50
10
0.010 (0.250)
—
—
—
0.007 (0.180)
S
N
S
S
N
ECLinPS and ECLinPS Lite
M
S
S
M
T L –M
T L –M
T L –M
DL140 — Rev 4
S
S
S
N
N
N
S
S
S