MC74LCX541DW ON Semiconductor, MC74LCX541DW Datasheet - Page 7
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MC74LCX541DW
Manufacturer Part Number
MC74LCX541DW
Description
IC BUFF/DVR TRI-ST 8BIT 20SOIC
Manufacturer
ON Semiconductor
Series
74LCXr
Datasheet
1.MC74LCX541DTR2G.pdf
(8 pages)
Specifications of MC74LCX541DW
Logic Type
Buffer/Line Driver, Non-Inverting
Number Of Elements
1
Number Of Bits Per Element
8
Current - Output High, Low
24mA, 24mA
Voltage - Supply
2 V ~ 3.6 V
Operating Temperature
-40°C ~ 85°C
Mounting Type
Surface Mount
Package / Case
20-SOIC (7.5mm Width)
Lead Free Status / RoHS Status
Contains lead / RoHS non-compliant
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
e
20
1
0.13 (0.005)
Z
b
M
D
0.10 (0.004)
10
11
E
A
H
E
A
1
PACKAGE DIMENSIONS
VIEW P
http://onsemi.com
MC74LCX541
CASE 967−01
SOEIAJ−20
M SUFFIX
M
ISSUE O
_
L
E
7
L
DETAIL P
Q
1
c
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSIONS D AND E DO NOT INCLUDE MOLD
4. TERMINAL NUMBERS ARE SHOWN FOR
5. THE LEAD WIDTH DIMENSION (b) DOES NOT
Y14.5M, 1982.
FLASH OR PROTRUSIONS AND ARE MEASURED
AT THE PARTING LINE. MOLD FLASH OR
PROTRUSIONS SHALL NOT EXCEED 0.15 (0.006)
PER SIDE.
REFERENCE ONLY.
INCLUDE DAMBAR PROTRUSION. ALLOWABLE
DAMBAR PROTRUSION SHALL BE 0.08 (0.003)
TOTAL IN EXCESS OF THE LEAD WIDTH
DIMENSION AT MAXIMUM MATERIAL CONDITION.
DAMBAR CANNOT BE LOCATED ON THE LOWER
RADIUS OR THE FOOT. MINIMUM SPACE
BETWEEN PROTRUSIONS AND ADJACENT LEAD
TO BE 0.46 ( 0.018).
H
DIM
A
M
A
b
D
E
L
L
Q
Z
c
e
E
1
E
1
12.35
MILLIMETERS
MIN
0.05
0.35
0.18
5.10
7.40
0.50
0.70
1.10
−−−
−−−
0
1.27 BSC
_
12.80
MAX
10
2.05
0.20
0.50
0.27
5.45
8.20
0.85
1.50
0.90
0.81
_
0.002
0.014
0.007
0.486
0.201
0.291
0.020
0.043
0.028
MIN
−−−
−−−
0
0.050 BSC
INCHES
_
0.081
0.008
0.020
0.504
0.215
0.323
0.033
0.059
0.035
0.032
MAX
0.011
10
_