MC74HC125ADG ON Semiconductor, MC74HC125ADG Datasheet - Page 8

• Manufacturer Part Number: MC74HC125ADG
• Description: IC BUFF TRI-ST QD N-INV 14SOIC
• Manufacturer: ON Semiconductor
• Series: 74HCr

Specifications of MC74HC125ADG

• Logic Type: Buffer/Line Driver, Non-Inverting
• Number Of Elements: 4
• Number Of Bits Per Element: 1
• Current - Output High, Low: 7.8mA, 7.8mA
• Voltage - Supply: 2 V ~ 6 V
• Operating Temperature: -55°C ~ 125°C
• Mounting Type: Surface Mount
• Package / Case: 14-SOIC (3.9mm Width), 14-SOL
• Logic Family: HC
• Logical Function: Buffer/Line Driver
• Number Of Elements: 4
• Number Of Channels: 4
• Number Of Inputs: 4
• Number Of Outputs: 4
• Operating Supply Voltage (typ): 2.5/3.3/5V
• Package Type: SOIC
• Output Type: 3-State
• Polarity: Non-Inverting
• Propagation Delay Time: 180ns
• High Level Output Current: -7.8mA
• Low Level Output Current: 7.8mA
• Operating Supply Voltage (max): 6V
• Operating Supply Voltage (min): 2V
• Quiescent Current: 4uA
• Technology: CMOS
• Pin Count: 14
• Mounting: Surface Mount
• Operating Temp Range: -55C to 125C
• Operating Temperature Classification: Military
• Number Of Channels Per Chip: Quad
• Supply Voltage (max): 6 V
• Supply Voltage (min): 2 V
• Maximum Operating Temperature: 125 C
• Mounting Style: SMD/SMT
• Input Bias Current (max): 4 uA
• Maximum Power Dissipation: 500 mW
• Minimum Operating Temperature: - 55 C
• Number Of Lines (input / Output): 3
• Circuit Type: Low-Power Schottky
• Current, Supply: 160 μA
• Function Type: 4-Channels
• Logic Function: Buffer
• Number Of Circuits: Quad
• Special Features: Non-Inverting, Tri-State
• Temperature, Operating, Range: -55 to +125 °C
• Voltage, Supply: 2 to 6 V
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Other names: MC74HC125ADG; MC74HC125ADGOS

−T−
0.15 (0.006) T
0.15 (0.006) T
0.10 (0.004)
SEATING
PLANE
L
U
U
PIN 1
IDENT.
2X
D
S
S
L/2
C
14
1
0.36
G
14X
14X
*For additional information on our Pb−Free strategy and soldering
−V−
A
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
K
0.10 (0.004)
REF
8
7
SOLDERING FOOTPRINT*
M
−U−
PACKAGE DIMENSIONS
1
B
T
H
1.26
14X
U
http://onsemi.com
J J1
N
CASE 948G−01
S
N
TSSOP−14
DETAIL E
ISSUE B
V
7.06
S
DETAIL E
8
SECTION N−N
Ç Ç Ç
Ç Ç Ç
É É É
Ç Ç Ç
É É É
F
K1
K
0.25 (0.010)
M
DIMENSIONS: MILLIMETERS
−W−
NOTES:
0.65
PITCH
1. DIMENSIONING AND TOLERANCING PER
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSION A DOES NOT INCLUDE MOLD
4. DIMENSION B DOES NOT INCLUDE
5. DIMENSION K DOES NOT INCLUDE
6. TERMINAL NUMBERS ARE SHOWN FOR
7. DIMENSION A AND B ARE TO BE
ANSI Y14.5M, 1982.
FLASH, PROTRUSIONS OR GATE BURRS.
MOLD FLASH OR GATE BURRS SHALL NOT
EXCEED 0.15 (0.006) PER SIDE.
INTERLEAD FLASH OR PROTRUSION.
INTERLEAD FLASH OR PROTRUSION SHALL
NOT EXCEED 0.25 (0.010) PER SIDE.
DAMBAR PROTRUSION. ALLOWABLE
DAMBAR PROTRUSION SHALL BE 0.08
(0.003) TOTAL IN EXCESS OF THE K
DIMENSION AT MAXIMUM MATERIAL
CONDITION.
REFERENCE ONLY.
DETERMINED AT DATUM PLANE −W−.
DIM
K1
J1
A
B
C
D
G
H
K
M
F
J
L
MILLIMETERS
MIN
4.90
4.30
0.05
0.50
0.50
0.09
0.09
0.19
0.19
−−−
0
0.65 BSC
6.40 BSC
_
MAX
5.10 0.193
4.50 0.169
1.20
0.15 0.002
0.75 0.020
0.60 0.020
0.20 0.004
0.16 0.004
0.30 0.007
0.25 0.007
8
_
MIN
−−− 0.047
0.026 BSC
0.252 BSC
0
INCHES
_
0.200
0.177
0.006
0.030
0.024
0.008
0.006
0.012
0.010
MAX
8
_