FPDK12SR8003PSV FDK CORPORATION, FPDK12SR8003PSV Datasheet - Page 7

• Manufacturer Part Number: FPDK12SR8003PSV
• Description: 5.6-14.0vdc Input, 3a, 0.8-6.6vdc Output
• Manufacturer: FDK CORPORATION

FPDK12SR8003PSV
5.6-14.0Vdc Input, 3A, 0.8-6.6Vdc Output
Characterization
Overview
The converter has been characterized for several
operational features, including thermal derating
(maximum available load current as a function of
ambient temperature and airflow), efficiency, power
dissipation, start-up and shutdown characteristics,
ripple and noise, and transient response to load
step-changes.
このｺﾝﾊﾞｰﾀは温度ﾃﾞｨﾚｰﾃｨﾝｸﾞ、効率、電力損失、ｽﾀｰﾄｱｯﾌﾟ時、及び
ｼｬｯﾄﾀﾞｳﾝ時の動作、ﾘｯﾌﾟﾙ･ﾉｲｽﾞ、動的負荷変動などを含む、さまざま
な動作状態で特徴付けられます。
Figures showing data plots and waveforms for
different output voltages are presented in the
following pages.
各出力電圧時のﾃﾞｰﾀ、及び波形の図は以後のﾍﾟｰｼﾞに掲載されていま
す。
Test Conditions
To
reproducibility, all thermal and efficiency data were
taken with the converter soldered to a standardized
thermal test board. The thermal test board was
mounted inside FDK’s custom wind tunnel to enable
precise control of ambient temperature and airflow
conditions.
測定精度、及び再現性を確実にするために、全ての温度、及び効率
ﾃﾞｰﾀは標準化された温度評価ﾎﾞｰﾄﾞにｺﾝﾊﾞｰﾀを半田付けして取得して
います。温度評価ﾎﾞｰﾄﾞをFDK特製の風洞実験設備内に設置すること
で、環境温度、及び風量を精密に管理しています。
The thermal test board comprised a four layer printed
circuit board (PCB) with a total thickness of 0.060”.
Copper metallization on the two outer layers was
limited to pads and traces needed for soldering the
converter and peripheral components to the board.
The two inner layers comprised power and ground
planes of 2 oz. copper. This thermal test board, with
the paucity of copper on the outer surfaces, limits
heat transfer from the converter to the PCB, thereby
providing a worst-case but consistent set of
conditions for thermal measurements.
温度評価ﾎﾞｰﾄﾞは厚さ0.060”(1.6mm)厚の4層PCBで作成しています。表
面2層の銅箔はｺﾝﾊﾞｰﾀを実装するためのﾊﾟｯﾄﾞと周辺部品へのﾊﾟﾀｰﾝの
みに限定しています。内側2層は70μmの銅箔で電力、及びｸﾞﾗﾝﾄﾞﾗｲﾝ
を形成しています。このように表層の銅箔を限りなく少なくした温度評価
ﾎﾞｰﾄﾞは、ｺﾝﾊﾞｰﾀからPCBへの熱の逃げを制限し、ﾜｰｽﾄｹｰｽでありな
がら矛盾の無い温度評価条件を実現しています。
http://www.fdk.com
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Page 7 of 13
and
FDK’s custom wind tunnel was used to provide
precise horizontal laminar airflow in the range of 50
LFM to 600LFM, at ambient temperatures between
30°C and 85°C. Infrared (IR) thermography and
thermocouples
measurements. (See Fig. C & Fig. D)
FDK特製の風洞実験装置は水平方向の層流を50LFM(自然対流と同
等、NC)から600LFMまで精密に制御でき、環境温度は30℃から85℃を
制御できます。温度測定には赤外線(IR)ｻｰﾓｸﾞﾗﾌｨと熱電対を使用して
います。(図C及びD参照)
Thermal Derating
Fig.1 show the maximum available load current vs.
ambient temperature and airflow rates. Ambient
temperature was varied between 30°C and 85°C,
with airflow rates from NC(50LFM) to 400LFM
(0.25m/s to 2.0m/s). The converter was mounted
horizontally, and the airflow was parallel to the long
axis of the converter, going from pin 1 to pin 8.
図1はある環境温度と風量の条件下における最大出力電流を表しま
す。環境温度は風量NC(50LFM)～400LFMの条件で30℃～85℃の間を
変動させています。ｺﾝﾊﾞｰﾀは水平に設置し、風向きはｺﾝﾊﾞｰﾀの長手方
向に平行で1番ﾋﾟﾝから8番ﾋﾟﾝに向けて吹いています。
Fig. C: FDK Original Wind Tunnel
Fig. D: Test Chamber
were
used
Ver 2.2 Oct.23, 2009
Data Sheet
for
temperature
Series