MT9M012 Aptina Imaging Corporation, MT9M012 Datasheet
MT9M012
Related parts for MT9M012
MT9M012 Summary of contents
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... Products and specifications discussed herein are subject to change by Aptina without notice. Specifications discussed herein are subject to change without notice. This product is sold “as is” and is delivered with no guarantees or warranties, express or implied. MT9M012: 1.6Mp CMOS Digital Image Sensor Die Die Database • Die outline, see Figure 2 on page 11 • ...
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... Operating temperature: –30°C to +70°C General Description The Aptina™ MT9M012 is a 1/4.5-inch format CMOS active-pixel digital image sensor die with a pixel array of 1472H x 1096V. The default active imaging array size is 1440H x 1080V. It incorporates sophisticated on-die camera functions such as windowing, mirroring, and snapshot mode ...
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... Bonding Instructions The MT9M012 imager die has 124 bond pads. Refer to Table 1 and Table 2 on pages 5–10 for a complete list of bond pads and coordinates. The MT9M012 imager die does not require the user to determine bond option features. The die also has several pads defined as “do not use.” These pads are reserved for engi- neering purposes and should not be used ...
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... Typical connection shows only one scenario out of multiple possible variations for this sensor. 2. All inputs must be configured with All power supplies should be adequately decoupled. 5. All PDF: 3518383133/Source: 6156369317 MT9M012_DDS - Rev. C; Pub. 5/10 EN MT9M012: 1.6Mp CMOS Digital Image Sensor Die V _IO Vdd_IO V ...
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... OUT OUT OUT 41 V _IO8 _IO7 DD PDF: 3518383133/Source: 6156369317 MT9M012_DDS - Rev. C; Pub. 5/10 EN MT9M012: 1.6Mp CMOS Digital Image Sensor Die 1 “X” “Y” Microns Microns 0.00 141.84 283.68 414.72 568.14 726.48 857.52 1050.32 1232.64 1363.68 1556.48 1738.80 1869.84 4 2062.64 2244 ...
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... DD 83 TEST GND 85 V _IO22 OUT PDF: 3518383133/Source: 6156369317 MT9M012_DDS - Rev. C; Pub. 5/10 EN MT9M012: 1.6Mp CMOS Digital Image Sensor Die 1 1 “X” “Y” Microns Microns 6098.87 –1995.02 6098.87 –2126.86 6098.87 –2382.79 6098.87 –2514.63 6098.87 –2646.47 6098.87 – ...
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... DNU = do not use. See “Bonding Instructions” on page 3. 3. All TEST bond pads must be tied LINE_VALID requires an external pull-down resistor (typically 10k–100kΩ) to DGND for normal device operation. PDF: 3518383133/Source: 6156369317 MT9M012_DDS - Rev. C; Pub. 5/10 EN MT9M012: 1.6Mp CMOS Digital Image Sensor Die 1 1 “X” “Y” Microns Microns 1553 ...
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... OUT 41 V _IO8 _IO7 GND 2 44 DNU PDF: 3518383133/Source: 6156369317 MT9M012_DDS - Rev. C; Pub. 5/10 EN MT9M012: 1.6Mp CMOS Digital Image Sensor Die 1 “X” “Y” Microns Microns –2865.08 3035.07 –2723.24 3035.07 –2581.40 3035.07 –2450.36 3035.07 –2296.95 3035.07 –2138.60 3035.07 – ...
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... GND 85 V _IO22 OUT GND 88 V _IO21 DD PDF: 3518383133/Source: 6156369317 MT9M012_DDS - Rev. C; Pub. 5/10 EN MT9M012: 1.6Mp CMOS Digital Image Sensor Die 1 1 “X” “Y” Microns Microns 3233.79 652.28 3233.79 520.44 3233.79 388.60 3233.79 132.67 3233.79 0.83 3233.79 –131.01 3233.79 – ...
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... DNU = do not use. See “Bonding Instructions” on page 3. 3. All TEST bond pads must be tied LINE_VALID requires an external pull-down resistor (typically 10k–100kΩ) to DGND for normal device operation. PDF: 3518383133/Source: 6156369317 MT9M012_DDS - Rev. C; Pub. 5/10 EN MT9M012: 1.6Mp CMOS Digital Image Sensor Die 1 1 “X” “Y” Microns Microns – ...
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... PDF: 3518383133/Source: 6156369317 MT9M012_DDS - Rev. C; Pub. 5/10 EN MT9M012: 1.6Mp CMOS Digital Image Sensor Die Center of pad 1 (Table 1) or center of die (Table First clear pixel (col ...
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... Last clear pixel (col. 1,471, row 1,147) From die center: From center of pad 1: Figure 3: Die Orientation in Reconstructed Wafer 276mm PDF: 3518383133/Source: 6156369317 MT9M012_DDS - Rev. C; Pub. 5/10 EN MT9M012: 1.6Mp CMOS Digital Image Sensor Die 276mm 12 Physical Specifications www.DataSheet4U.com Dimensions 200μm ±12μm 6,748 ±25μm 6,351 ± ...
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... This data sheet contains minimum and maximum limits specified over the power supply and temperature range set forth herein. Although considered final, these specifications are subject to change, as further product development and data characterization sometimes occur. PDF: 3518383133/Source: 6156369317 MT9M012_DDS - Rev. C; Pub. 5/10 EN MT9M012: 1.6Mp CMOS Digital Image Sensor Die Aptina reserves the right to change products or specifications without notice. 13 Revision History www.DataSheet4U.com © ...