PS2561D-1 Renesas Electronics Corporation., PS2561D-1 Datasheet - Page 10

• Manufacturer Part Number: PS2561D-1
• Description: Dip Photocoupler Operating Ambient Temperature 110?c
• Manufacturer: Renesas Electronics Corporation.

NOTES ON HANDLING
1. Recommended soldering conditions
(1) Infrared reflow soldering
(2) Wave soldering
(3) Soldering by soldering iron
10
• Peak reflow temperature
• Time of peak reflow temperature
• Time of temperature higher than 220°C
• Time to preheat temperature from 120 to 180°C
• Number of reflows
• Flux
• Temperature
• Time
• Preheating conditions
• Number of times
• Flux
• Peak temperature (lead part temperature)
• Time (each pins)
• Flux
(a) Soldering of leads should be made at the point 1.5 to 2.0 mm from the root of the lead.
(b) Please be sure that the temperature of the package would not be heated over 100°C.
260°C or below (molten solder temperature)
10 seconds or less
120°C or below (package surface temperature)
One (Allowed to be dipped in solder including plastic mold portion.)
Rosin flux containing small amount of chlorine (The flux with a maximum chlorine
content of 0.2 Wt% is recommended.)
Recommended Temperature Profile of Infrared Reflow
120°C
Preliminary Data Sheet PN10777EJ01V0DS
(preheating)
120±30 s
350°C or below
3 seconds or less
Rosin flux containing small amount of chlorine (The flux with a
maximum chlorine content of 0.2 Wt% is recommended.)
PS2561D-1,PS2561DL-1,PS2561DL1-1,PS2561DL2-1
180°C
260°C or below (package surface temperature)
10 seconds or less
60 seconds or less
120±30 s
Three
Rosin flux containing small amount of chlorine (The flux with a
maximum chlorine content of 0.2 Wt% is recommended.)
Time (s)
(heating)
to 60 s
to 10 s
260°C MAX.
220°C