TSOP57556 Vishay, TSOP57556 Datasheet - Page 7

• Manufacturer Part Number: TSOP57556
• Description: (TSOP573xx / TSOP575xx) IR Receiver Modules
• Manufacturer: Vishay

ASSEMBLY INSTRUCTIONS
Reflow Soldering
• Reflow soldering must be done within 72 h while stored
• Set the furnace temperatures for pre-heating and heating
• Handling after reflow should be done only after the work
VISHAY LEAD (Pb)-FREE REFLOW SOLDER PROFILE
Note
(1)
Revision: 1.1, 09-Mar-12
ORDERING INFORMATION
ORDERING CODE
TSOP57..TT1
TSOP57..TT2
under a max. temperature of 30 °C, 60 % RH after
opening the dry pack envelope
in accordance with the reflow temperature profile as
shown in the diagram. Excercise extreme care to keep the
maximum temperature below 260 °C. The temperature
shown in the profile means the temperature at the device
surface. Since there is a temperature difference between
the component and the circuit board, it should be verified
that the temperature of the device is accurately being
measured
surface has been cooled off
MOQ: minimum order quantity
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
www.vishay.com
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT
300
250
200
150
100
19800
50
0
0
255 °C
217 °C
240 °C
max. Ramp Up 3 °C/s
50
max. 120 s
100
PACKAGING
Tape and reel
t (s)
150
7
max. Ramp Down 6 °C/s
www.DataSheet.co.kr
Manual Soldering
• Use a soldering iron of 25 W or less. Adjust the
• Finish soldering within 3 s
• Handle products only after the temperature has cooled off
max. 2 cycles allowed
max. 100 s
200
max. 20 s
temperature of the soldering iron below 300 °C
max. 260 °C
250
MOQ: 1800 pcs
MOQ: 7000 pcs
245 °C
VOLUME
www.vishay.com/doc?91000
300
TSOP573.., TSOP575..
(1)
Vishay Semiconductors
3.95 mm x 3.95 mm x 0.75 mm
Document Number: 82450
REMARKS
Datasheet pdf - http://www.DataSheet4U.net/