MUN5111 ON Semiconductor, MUN5111 Datasheet - Page 12

• Manufacturer Part Number: MUN5111
• Description: Bias Resistor Transistor PNP
• Manufacturer: ON Semiconductor

design. The footprint for the semiconductor packages must
be the correct size to insure proper solder connection
tion of the pad size. This can vary from the minimum pad
size for soldering to the pad size given for maximum power
dissipation. Power dissipation for a surface mount device
is determined by T
perature of the die, R
device junction to ambient; and the operating temperature,
T
calculated as follows.
ratings table on the data sheet. Substituting these values into
temperature of the device. When the entire device is heated
to a high temperature, failure to complete soldering within
a short time could result in device failure. Therefore, the
following items should always be observed in order to
minimize the thermal stress to which the devices are
subjected.
A
Surface mount board layout is a critical portion of the total
The power dissipation of the SC–70/SOT–323 is a func-
The values for the equation are found in the maximum
The melting temperature of solder is higher than the rated
soldering should be 100 C or less.*
leads and the case must not exceed the maximum
temperature ratings as shown on the data sheet. When
using infrared heating with the reflow soldering
method, the difference should be a maximum of 10 C.
Always preheat the device.
The delta temperature between the preheat and
When preheating and soldering, the temperature of the
. Using the values provided on the data sheet, P
INFORMATION FOR USING THE SC–70/SOT–323 SURFACE MOUNT PACKAGE
MINIMUM RECOMMENDED FOOTPRINT FOR SURFACE MOUNTED APPLICATIONS
J(max)
P
D
=
JA
, the maximum rated junction tem-
, the thermal resistance from the
T
J(max)
R
JA
– T
A
SC–70/SOT–323 POWER DISSIPATION
SOLDERING PRECAUTIONS
MUN5111T1 Series
D
http://onsemi.com
can be
12
* Soldering a device without preheating can cause exces-
sive thermal shock and stress which can result in damage
to the device.
the equation for an ambient temperature T
can calculate the power dissipation of the device which in
this case is 200 milliwatts.
footprint on a glass epoxy printed circuit board to achieve
a power dissipation of 200 milliwatts. Another alternative
would be to use a ceramic substrate or an aluminum core
board such as Thermal Clad . Using a board material such
as Thermal Clad, a higher power dissipation of 300 milli-
watts can be achieved using the same footprint.
interface between the board and the package. With the
correct pad geometry, the packages will self align when
subjected to a solder reflow process.
260 C for more than 10 seconds.
maximum temperature gradient should be 5 C or less.
be allowed to cool naturally for at least three minutes.
Gradual cooling should be used as the use of forced
cooling will increase the temperature gradient and
result in latent failure due to mechanical stress.
ing cooling
The 0.625 C/W assumes the use of the recommended
The soldering temperature and time should not exceed
When shifting from preheating to soldering, the
After soldering has been completed, the device should
Mechanical stress or shock should not be applied dur-
P
D
=
150 C – 25 C
0.625 C/W
= 200 milliwatts
A
of 25 C, one