PZT2222A-AA3-R ON Semiconductor, PZT2222A-AA3-R Datasheet
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PZT2222A-AA3-R
Related parts for PZT2222A-AA3-R
PZT2222A-AA3-R Summary of contents
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... The formed leads absorb thermal stress during soldering, eliminating the possibility of damage to the die. Available tape and reel Use PZT2222AT1 to order the 7 inch/1000 unit reel. Use PZT2222AT3 to order the 13 inch/4000 unit reel. MAXIMUM RATINGS Rating ...
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... PZT2222AT1 ELECTRICAL CHARACTERISTICS — continued Characteristic OFF CHARACTERISTICS (continued) Collector-Base Cutoff Current ( Vdc Vdc 125 C) ON CHARACTERISTICS DC Current Gain ( 0.1 mAdc Vdc 1.0 mAdc Vdc mAdc Vdc mAdc Vdc – 150 mAdc Vdc 150 mAdc ...
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... Figure 2. Input Waveform and Test Circuit for Determining Storage Time and Fall Time Motorola Small–Signal Transistors, FETs and Diodes Device Data 90% 10 OSCILLOSCOPE 200 ns INPUT IMPEDANCE INPUT CAPACITANCE = 0.02 RISE TIME TIME D1 PZT2222AT1 D.U. > 100 < < D.U. ...
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... PZT2222AT1 INFORMATION FOR USING THE SOT-223 SURFACE MOUNT PACKAGE MINIMUM RECOMMENDED FOOTPRINT FOR SURFACE MOUNTED APPLICATIONS Surface mount board layout is a critical portion of the total design. The footprint for the semiconductor packages must be the correct size to insure proper solder connection The power dissipation of the SOT-223 is a function of the pad size ...
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... C 160 C 150 C SOLDER IS LIQUID FOR SECONDS 100 C 140 C (DEPENDING ON MASS OF ASSEMBLY) DESIRED CURVE FOR LOW MASS ASSEMBLIES Figure 4. Typical Solder Heating Profile PZT2222AT1 STEP 6 STEP 7 VENT COOLING 205 TO 219 C PEAK AT SOLDER JOINT T MAX 5 ...
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... DIM MIN MAX MIN MAX A 0.249 0.263 6.30 6.70 B 0.130 0.145 3.30 3.70 C 0.060 0.068 1.50 1.75 D 0.024 0.035 0.60 0.89 F 0.115 0.126 2.90 3.20 G 0.087 0.094 2.20 2.40 H 0.0008 0.0040 0.020 0.100 J 0.009 0.014 0.24 0.35 K 0.060 0.078 1.50 2.00 L 0.033 0.041 0.85 1. 0.264 0.287 6.70 7.30 STYLE 1: PIN 1. BASE 2. COLLECTOR 3. EMITTER 4. COLLECTOR PZT2222AT1/D ...