BSP32 Philips Semiconductors (Acquired by NXP), BSP32 Datasheet - Page 2

• Manufacturer Part Number: BSP32
• Description: BSP31; BSP32; BSP33; PNP Medium Power Transistors;; Package: SOT223 (SC-73)
• Manufacturer: Philips Semiconductors (Acquired by NXP)

Philips Semiconductors
FEATURES
APPLICATIONS
DESCRIPTION
PNP medium power transistor in a SOT223 plastic
package. NPN complements: BSP41 and BSP43.
LIMITING VALUES
In accordance with the Absolute Maximum Rating System (IEC 134).
Note
1. Device mounted on a printed-circuit board, single sided copper, tinplated, mounting pad for collector 1 cm
1999 Apr 26
V
V
V
I
I
I
P
T
T
T
SYMBOL
C
CM
BM
stg
j
amb
High current (max. 1 A)
Low voltage (max. 80 V).
Telephony and general industrial applications.
CBO
CEO
EBO
tot
PNP medium power transistors
For other mounting conditions, see “Thermal considerations for SOT223 in the General Part of associated
Handbook”.
collector-base voltage
collector-emitter voltage
emitter-base voltage
collector current (DC)
peak collector current
peak base current
total power dissipation
storage temperature
junction temperature
operating ambient temperature
BSP31
BSP32; BSP33
BSP32; BSP33
BSP31
PARAMETER
open emitter
open base
open collector
T
amb
2
= 25 C; note 1
PINNING
handbook, halfpage
CONDITIONS
Fig.1 Simplified outline (SOT223) and symbol.
PIN
2, 4
1
3
Top view
1
base
collector
emitter
BSP31; BSP32; BSP33
2
4
65
65
3
MIN.
DESCRIPTION
MAM288
Product specification
1.3
+150
150
+150
70
90
60
80
5
1
2
200
1
MAX.
2, 4
3
V
V
V
V
V
A
A
mA
W
C
C
C
2
.
UNIT