CMF03 Toshiba America Electronic Components, Inc., CMF03 Datasheet - Page 2

• Manufacturer Part Number: CMF03
• Description: Switching Mode Power Supply Applications
• Manufacturer: Toshiba America Electronic Components, Inc.

Electrical Characteristics
Marking
Handling Precautions
Thermal resistance between junction and ambient fluctuates depending on the mounting condition of the device. When
using the device, be sure to design the circuit board and soldering land size to match the appropriate thermal resistance
value.
Refer to the Rectifier databook for further information.
Peak forward voltage
Repetitive peak reverse current
Reverse recovery time
Forward recovery time
Thermal resistance
Thermal resistance (junction to lead)
Abbreviation Code
F3
Characteristic
CMF03
Part No.
(Ta = 25°C)
Symbol
R
R
I
V
RRM
th (j-a)
th (j-ℓ)
trr
tfr
FM
I
V
I
I
Device mounted on a ceramic board
(board size: 50 mm × 50 mm)
(soldering land: 2 mm × 2 mm)
(board thickness: 0.64 t)
Device mounted on a glass-epoxy
board
(board size: 50 mm × 50 mm)
(soldering land: 6 mm × 6 mm)
(board thickness: 1.6 t)
Device mounted on a glass-epoxy
board
(board size: 50 mm × 50 mm)
(soldering land: 2.1 mm × 1.4 mm)
(board thickness: 1.6 t)
FM
F
F
RRM
= 1 A, di/dt ＝-30 A/μs
= 1 A
= 0.5 A (pulse test)
= 900 V (pulse test)
2
Standard Soldering Pad
Test Condition
1.4
⎯
3.0
Min
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
1.4
Unit: mm
Typ.
550
⎯
⎯
⎯
⎯
⎯
⎯
⎯
2007-04-09
Max
100
135
210
2.5
50
60
16
⎯
CMF03
°C/W
°C/W
Unit
μA
ns
ns
V