ADCMP605 Analog Devices, ADCMP605 Datasheet - Page 14

• Manufacturer Part Number: ADCMP605
• Description: (ADCMP604 / ADCMP605) Single-Supply LVDS Comparators
• Manufacturer: Analog Devices

ADCMP604/ADCMP605
OUTLINE DIMENSIONS
ORDERING GUIDE
Model
ADCMP604BKSZ-R2
ADCMP604BKSZ-REEL7
ADCMP604BKSZ-RL
ADCMP605BCPZ-WP
ADCMP605BCPZ-R2
ADCMP605BCPZ-R7
EVAL-ADCMP605BCPZ
1
Z = Pb-free part.
0.10 MAX
Figure 27. 6-Lead Thin Shrink Small Outline Transistor Package (SC70)
1.00
0.90
0.70
1.35
1.25
1.15
1.30 BSC
PIN 1
0.10 COPLANARITY
COMPLIANT TO JEDEC STANDARDS MO-203-AB
1
6
0.30
0.15
Dimensions shown in millimeters
2.20
2.00
1.80
5
2
1
1
1
1
1
1
1
4
3
0.65 BSC
SEATING
PLANE
Temperature
Range
−40°C to +125°C
−40°C to +125°C
−40°C to +125°C
−40°C to +125°C
−40°C to +125°C
−40°C to +125°C
1.10
0.80
(KS-6)
2.40
2.10
1.80
0.40
0.10
0.22
0.08
Package Description
6-Lead Thin Shrink Small Outline Transistor Package (SC70)
6-Lead Thin Shrink Small Outline Transistor Package (SC70)
6-Lead Thin Shrink Small Outline Transistor Package (SC70)
12-Lead Lead Frame Chip Scale Package (LFCSP-VQ)
12-Lead Lead Frame Chip Scale Package (LFCSP-VQ)
12-Lead Lead Frame Chip Scale Package (LFCSP-VQ)
Evaluation Board
0.46
0.36
0.26
Rev. 0 | Page 14 of 16
INDICATOR
SEATING
PLANE
1.00
0.85
0.80
PIN 1
Figure 28. 12-Lead Lead Frame Chip Scale Package (LFCSP-VQ)
12° MAX
BSC SQ
VIEW
TOP
0.30
0.23
0.18
3.00
0.80 MAX
0.65 TYP
* COMPLIANT TO JEDEC STANDARDS MO-220-VEED-1
3 mm × 3 mm Body, Very Thin Quad
EXCEPT FOR EXPOSED PAD DIMENSION.
Dimensions shown in millimeters
BSC SQ
0.20 REF
2.75
0.05 MAX
0.02 NOM
(BOTTOM VIEW)
(CP-12-1)
EXPOSED PAD
0.45
COPLANARITY
0.60 MAX
BSC
0.50
0.08
Package
Option
KS-6
KS-6
KS-6
CP-12-1
CP-12-1
CP-12-1
9
8
7
10
6
11
5
12
4
1
2
3
0.75
0.55
0.35
Branding
G0Q
G0Q
G0Q
G0K
G0K
G0K
* 1.45
0.25 MIN
1.30 SQ
1.15
PIN 1
INDICATOR