AT93C46D ATMEL Corporation, AT93C46D Datasheet

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... PDIP, 8-lead JEDEC SOIC, 8-lead Ultra Thin mini- MAP (MLP 2x3), 8-lead TSSOP, and 8-lead dBGA2 packages. The AT93C46D is enabled through the Chip Select pin (CS) and accessed via a three-wire serial interface consisting of Data Input (DI), Data Output (DO), and Shift Clock (SK) ...

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... Meg ohm pullup, then the “x 16” organization is selected. 2. For the AT93C46D, if the “x 16” organization is the mode of choice and pin 6 (ORG) is left unconnected, Atmel see the AT93C46E datasheet. ...

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Table 2. Pin Capacitance Applicable over recommended operating range from T Symbol Test Conditions C Output Capacitance (DO) OUT C Input Capacitance (CS, SK, DI) IN Note: 1. This parameter is characterized and is not 100% tested. Table 3. ...

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... PD0 “0” Status t SV Valid High t DF Impedance t Write Cycle Time WP (1) Endurance 5.0V, 25°C Note: 1. This parameter is ensured by characterization. AT93C46D [Preliminary −40° 85° Test Condition 4.5V ≤ V ≤ 5.5V CC 2.7V ≤ V ≤ 5.5V CC 1.8V ≤ V ≤ 5.5V CC 4.5V ≤ V ≤ 5.5V CC 2.7V ≤ V ≤ ...

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... The AT93C46D is accessed via a simple and versatile three-wire serial communication interface. Device operation is controlled by seven instructions issued by the host pro- cessor. A valid instruction starts with a rising edge of CS and consists of a start bit (logic “1”) followed by the appropriate op code and the desired memory address location. ...

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... Erase/Write Disable (EWDS) instruction disables all programming modes and should be executed after all programming operations. The operation of the Read instruction is independent of both the EWEN and EWDS instructions and can be executed at any time. µs Table 6. Organization Key for Timing Diagrams AT93C46D (1K) I ...

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Figure 3. READ Timing High Impedance Figure 4. EWEN Timing Figure 5. EWDS Timing 5193C–SEEPR–3/07 ... ... ...

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... Figure 6. WRITE Timing HIGH IMPEDANCE DO (1) Figure 7. WRAL Timing HIGH IMPEDANCE DO Note: 1. Valid only 4.5V to 5.5V. CC Figure 8. ERASE Timing HIGH IMPEDANCE DO AT93C46D [Preliminary] 8 ... ... ... ... N-1 N BUSY ...

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Figure 9. ERAL Timing HIGH IMPEDANCE DO Note: 1. Valid only 4.5V to 5.5V. CC 5193C–SEEPR–3/ STANDBY CHECK STATUS BUSY HIGH IMPEDANCE ...

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... AT93C46D Ordering Information Ordering Code AT93C46D-PU (Bulk form only) (1) AT93C46DN-SH-B (NiPdAu Lead finish) (2) AT93C46DN-SH-T (NiPdAu Lead finish) (1) AT93C46D-TH-B (NiPdAu Lead finish) (2) AT93C46D-TH-T (NiPdAu Lead finish) (2) AT93C46DY6-YH-T (NiPdAu Lead finish) (2) AT93C46DU3-UU-T (3) AT93C46D-W-11 Notes: 1. “-B” denotes bulk 2. “-T” denotes tape and reel. SOIC = 4K per reel. TSSOP, Ultra Thin Mini MAP, and dBGA2 = 5K per reel. ...

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Packaging Information 8P3 – PDIP Top View PLCS Side View Notes: 1. This drawing is for general information only; refer to JEDEC Drawing MS-001, Variation BA for additional information. 2. Dimensions A and L are measured ...

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... JEDEC SOIC Top View e Side View Note: These drawings are for general information only. Refer to JEDEC Drawing MS-012, Variation AA for proper dimensions, tolerances, datums, etc. 1150 E. Cheyenne Mtn. Blvd. Colorado Springs, CO 80906 R AT93C46D [Preliminary TITLE 8S1, 8-lead (0.150" ...

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TSSOP Pin 1 indicator this corner N Top View Side View Notes: 1. This drawing is for general information only. Refer to JEDEC Drawing MO-153, Variation AA, for proper dimensions, tolerances, datums, ...

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... Bottem View 8 SOLDER BALLS 1. This drawing is for general information only. 2. Dimension 'b' is measured at maximum solder ball diameter. 1150 E. Cheyenne Mtn. Blvd. Colorado Springs, CO 80906 R AT93C46D [Preliminary TITLE 8U3-1, 8-ball, 1.50 x 2.00 mm Body, 0.50 mm pitch, Small Die Ball Grid Array Package (dBGA2) 1 ...

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Mini-MAP D Notes: 1. This drawing is for general information only. Refer to JEDEC Drawing MO-229, for proper dimensions, tolerances, datums, etc. 2. Dimension b applies to metallized terminal and is measured between 0.15 mm and 0.30 mm ...

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... Revision History AT93C46D [Preliminary] 16 Doc. Rev. Date Comments 5193C 3/2007 Corrected Figures 4 and 5. 5193B 2/2007 Added ‘Ultra Thin’ description to 8-lead Mini-MAP package. 5193A 1/2007 Initial document release. 5193C–SEEPR–3/07 ...

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... Atmel products are not suitable for, and shall not be used in, automotive applications. Atmel’s products are not intended, authorized, or warranted for use as components in applications intended to support or sustain life. ©2007 Atmel Corporation. All rights reserved. Atmel marks or trademarks of Atmel Corporation or its subsidiaries. Other terms and product names may be trademarks of others. Atmel Operations Memory ...