HSMT-C265 HP, HSMT-C265 Datasheet - Page 5

• Manufacturer Part Number: HSMT-C265
• Description: (HSMx-C265) AlInGaP chipLED
• Manufacturer: HP

Figure 3: Tape Dimensions
Figure 4: Tape Leader and Trailer Dimensions.
Notes:
1. All dimensions in millimeters (inches).
2. Tolerance is ± 0.1 mm (± 0.004 in.) unless otherwise specified.
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Data subject to change.
Copyright 2003 Agilent Technologies, Inc.
Revision Date: xx-xx-xxxx
Agilent Technologies reserves the right to alter prices, specifications, features, capabilities, functions, release dates, and remove availability of the
product(s) at anytime.
5
END
THERE SHALL BE A MINIMUM OF
COMPONENT POCKETS SEALED
160mm (6.3in.) OF EMPTY
WITH COVER TAPE.
MOUNTED WITH
COMPONENTS.
THERE SHALL BE A MINIMUM OF
COMPONENT POCKETS SEALED
160mm (6.3in.) OF EMPTY
WITH COVER TAPE.
START
COVER TAPE
MINIMUM OF
(9.05in.) MAY
CONSIST OF
CARRIER
AND/OR
230mm
Convective IR Reflow
Soldering
For more information on IR
reflow soldering, refer to
Application Note 1060,
Surface Mounting SMT LED
Indicator Components.
Storage Condition : 5
to 30
Baking
the condition :
a) the
b) the pack has been open
Baking recommended
condition : 60 ± 5
20 hrs
indicator
white
color
for more than 1 week
O
C @ 60%RH max.
blue
is required under
/
silica
transparent
O
becoming
C for
gel