LVE67C-S1T1-1 Infineon Technologies Corporation, LVE67C-S1T1-1 Datasheet - Page 14

• Manufacturer Part Number: LVE67C-S1T1-1
• Manufacturer: Infineon Technologies Corporation

Empfohlenes Lötpaddesign
Recommended Solder Pad
Maße werden wie folgt angegeben: mm (inch) / Dimensions are specified as follows: mm (inch).
Gurtung / Polarität und Lage
Method of Taping / Polarity and Orientation Packing unit 2000/reel, ø180 mm
Maße werden wie folgt angegeben: mm (inch) / Dimensions are specified as follows: mm (inch).
2001-02-20
Padgeometrie für
verbesserte Wärmeableitung
Paddesign for
improved heat dissipation
1.5 (0.059)
6.1 (0.240)
2.9 (0.114)
2.8 (0.110)
Wellenlöten (TTW)
TTW Soldering
4 (0.157)
Cu Fläche / > 12 mm per pad
Cu-area
Verpackungseinheit 2000/Rolle, ø180 mm
oder 8000/Rolle, ø330 mm
or 8000/reel, ø330 mm
4 (0.157)
14
Lötstoplack
Solder resist
2 (0.079)
3.5 (0.138)
2.8 (0.110)
7.5 (0.295)
2
LB E67C, LV E67C, LT E67C
0.5 (0.020)
OHAY0536
C
C A
C
OHAY0583