BGA6589 Philips Semiconductors (Acquired by NXP), BGA6589 Datasheet - Page 3

• Manufacturer Part Number: BGA6589
• Description: BGA6589; Mmic Wideband Medium Power Amplifier
• Manufacturer: Philips Semiconductors (Acquired by NXP)

Philips Semiconductors
LIMITING VALUES
In accordance with the Absolute Maximum Rating System (IEC 60134)
Note
1. T
THERMAL CHARACTERISTICS
Note
1. T
STATIC CHARACTERISTICS
T
2003 Sep 19
V
I
P
T
T
P
R
I
S
j
S
SYMBOL
stg
j
SYMBOL
SYMBOL
S
tot
D
th j-s
= 25 C; V
MMIC wideband medium power amplifier
s
s
is the temperature at the soldering point of pin 2.
is the temperature at the soldering point of pin 2.
S
= 9 V; R
DC device voltage
DC supply current
total power dissipation
storage temperature
operating junction temperature
maximum drive power
thermal resistance from junction to solder point T
supply current
PARAMETER
bias
PARAMETER
= 51
PARAMETER
unless otherwise specified.
CONDITIONS
RF input AC coupled
T
s
70 C; note 1
3
CONDITIONS
s
70 C note 1
CONDITIONS
MIN.
73
65
TYP.
MIN.
81
Product specification
6
150
800
+150
150
15
VALUE
MAX.
MAX.
BGA6589
100
89
V
mA
mW
dBm
C
C
UNIT
UNIT
UNIT
K/W
mA