BGA2011 Philips Semiconductors (Acquired by NXP), BGA2011 Datasheet - Page 4

• Manufacturer Part Number: BGA2011
• Description: BGA2011; 900 MHZ High Linear Low Noise Amplifier;; Package: SOT363 (UMT6)
• Manufacturer: Philips Semiconductors (Acquired by NXP)

Philips Semiconductors
APPLICATION INFORMATION
List of components (see Fig.2)
Note
1. The stripline (w = 0.7 mm) is on a gold plated double copper-clad printed-circuit board (
2000 Dec 04
handbook, full pagewidth
C1, C2
C3, C5
C4
C6
L1
L2
COMPONENT
900 MHz high linear low noise amplifier
board thickness = 0.64 mm, copper thickness = 35 m, gold thickness = 5 m.
RF in
multilayer ceramic chip capacitor
multilayer ceramic chip capacitor
multilayer ceramic chip capacitor
multilayer ceramic chip capacitor
SMD inductor
SMD inductor
V C
C1
DESCRIPTION
L1
C6
V C
C5
IN
SOT363
CIRCUIT
BIAS
Fig.2 Application circuit.
stripline
V S
4
APPLICATION
GND
TYPICAL
OUT
100 pF
5.6 pF
22 nF
C4
L2
C2
C3
APPLICATION
2 x 100 nF
HIGH IP3
V S
RF out
MLD480
100 pF
8.2 nH
5.6 pF
10 nH
22 nF
r
= 6.15),
Product specification
DIMENSIONS
BGA2011
0603
0603
0603
0805
0603
0603