PACDN1408C California Micro Devices Corp, PACDN1408C Datasheet
PACDN1408C
Manufacturer Part Number
PACDN1408C
Description
ESD PROTECTION ARRAYS/ CHIP SCALE PACKAGE
Manufacturer
California Micro Devices Corp
Datasheets
1.PACDN1408C-R.pdf
(3 pages)
2.PACDN1408C.pdf
(3 pages)
3.PACDN1408C.pdf
(3 pages)
4.PACDN1408C.pdf
(3 pages)
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Part Number:
PACDN1408C/R
Manufacturer:
CMD
Quantity:
20 000
Part Number:
PACDN1408CG
Manufacturer:
ON/安森美
Quantity:
20 000
© 2000 California Micro Devices Corp. All rights reserved.
6/19/2000
Features
• 8 transient voltage suppressors in a single chip
• Compact Chip Scale Package (CSP) format
• In-system Electro Static Discharge (ESD)
• PACDN2408C features back-to-back zener
Product Description
The PACDN1408C and PACDN2408C are transient
voltage suppressor arrays that provide a very high
level of protection for sensitive electronic components
that may be subjected to ESD. The back-to-back zener
connections of the PACDN2408C provides ESD
protection in cases where nodes with AC signals are
present.
These devices are designed and characterized to
safely dissipate ESD strikes at levels well beyond the
maximum requirements set forth in the IEC 61000-4-2
international standard (Level 4, 8kV contact dis-
scale wafer level package.
saves board space and ease layout in space
critical applications compared to discrete
solutions and traditional wire bonded packages.
protection to 20kV contact discharge per
IEC 61000-4-2 international standard.
protection for AC signals.
ESD PROTECTION ARRAY, 8 CHANNEL, CHIP SCALE PACKAGE
215 Topaz Street, Milpitas, California 95035
CALIFORNIA MICRO DEVICES
CALIFORNIA MICRO DEVICES
CALIFORNIA MICRO DEVICES
CALIFORNIA MICRO DEVICES
CALIFORNIA MICRO DEVICES
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SCHEMATIC DIAGRAMS
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Tel: (408) 263-3214
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Applications
• ESD protection of cellular phones, PDA, internet
• Protection of interface ports or IC pins which are
• PACDN2408C can be used for ESD protection of
charge). All I/Os are rated at 20kV using the IEC
61000-4-2 contact discharge method. Using the MIL-
STD-883D (Method 3015) specification for Human
Body Model (HBM) ESD, all pins are protected for
contact discharges to greater than 30kV.
The Chip Scale Package format of these devices
enable extremely small footprints that are necessary in
portable electronics such as cellular phones, PDAs,
internet appliances and PCs. The large solder bumps
allow for standard attachment to laminate boards
without the use of underfill.
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appliances and PC ports.
exposed to high levels of ESD.
set-top box R,L,V ports.
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Fax: (408) 263-7846
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www.calmicro.com
PACDN1408C
PACDN2408C
C1130600
1
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