AR1010 Microchip Technology, Inc., AR1010 Datasheet - Page 33

• Manufacturer Part Number: AR1010
• Manufacturer: Microchip Technology, Inc.

9 ELECTRICAL SPECIFICATIONS
9.1 Absolute Maximum Ratings
Ambient temperature under bias..........................................................................................................-40° to +125°C
Storage temperature ........................................................................................................................ -65°C to +150°C
Voltage on VDD with respect to VSS .................................................................................................. -0.3V to +6.5V
Voltage on all other pins with respect to VSS .......................................................................... -0.3V to (VDD + 0.3V)
Total power dissipation …..............................................................................................................................800 mW
Maximum current out of VSS pin ................................................................................................................... 300 mA
Maximum current into VDD pin ...................................................................................................................... 250 mA
Input clamp current (VI < 0 or VI > VDD)........................................................................................................± 20 mA
Maximum output current sunk by any I/O pin.................................................................................................... 25 mA
Maximum output current sourced by any I/O pin .............................................................................................. 25 mA
† NOTICE: Stresses above those listed under “Absolute Maximum Ratings” may cause permanent damage to the
device. This is a stress rating only and functional operation of the device at those or any other conditions above those
indicated in the operation listings of this specification is not implied. Exposure to maximum rating conditions for
extended periods may affect device reliability.
© 2009 Microchip Technology, Inc.
This device is sensitive to ESD damage and must be
handled appropriately. Failure to properly handle and
protect the device in an application may cause partial
to complete failure of the device.
(†)
DS41393A-Page 29