HFBR-5106T Agilent(Hewlett-Packard), HFBR-5106T Datasheet - Page 2

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HFBR-5106T

Manufacturer Part Number
HFBR-5106T
Description
100VG-AnyLAN Multimode Fiber Transceivers in Low Cost 1x9 Package Style
Manufacturer
Agilent(Hewlett-Packard)
Datasheet
These PlN/preamplifier combina-
tions are coupled to a custom
quantizer IC which provides the
final pulse shaping for the logic
output and Signal Detect
function. The data output is
differential. The signal detect
output is single-ended. Both data
and signal detect outputs are
PECL compatible, ECL
referenced (shifted) to a +5 Volt
power supply.
Package
The overall package concept for
the HP transceivers consists of
the following basic elements; two
optical subassemblies, an
electrical subassembly, and the
housing with integral duplex SC
connector receptacles. This is
illustrated in Figure 1.
The package outline and pinout
are shown in Figures 2 and 3.
The details of this package
outline and pinout are compliant
with the multisource definition of
the 1x9 SIP. The low profile of
the Hewlett- Packard transceiver
design complies with the maxi-
mum height allowed for the
duplex SC connector over the
entire length of the package.
The optical subassemblies utilize
a high volume process together
DIFFERENTIAL
DATA OUT
SINGLE-ENDED
SIGNAL
DETECT OUT
DIFFERENTIAL
DATA IN
Figure 1. Block Diagram.
ELECTRICAL SUBASSEMBLY
QUANTIZER IC
DRIVER IC
TOP VIEW
PREAMP
IC
with low cost lens elements which
result in a cost effective
transceiver.
The electrical subassembly con-
sists of a high volume multi-layer
printed circuit board on which
the IC chips and various surface
mount passive circuit elements
are attached.
The package includes internal
shields for the electrical and
optical subassemblies to ensure
low EMI and high immunity to
electromagnetic fields.
The outer housing, including the
duplex SC connector receptacle,
is molded of filled non-conductive
plastic to provide mechanical
strength and electrical isolation.
The solder posts of the Hewlett-
Packard design are isolated from
the circuit design of the
transceiver and do not require
connection to a ground plane on
the circuit board.
The transceiver is attached to a
printed circuit board with the
nine signal pins and the two
solder posts which exit the
bottom of the housing. The two
solder posts provide the primary
mechanical strength to withstand
the loads imposed on the duplex
DUPLEX SC
RECEPTACLE
PIN
PHOTODIODE
OPTICAL
SUBASSEMBLIES
LED
or simplex SC connectored fiber
cables.
Application Information
The Application Engineering
group in the Hewlett-Packard
Optical Communications Division
is available to assist you with the
technical understanding and
design trade-offs associated with
these transceivers. You can
contact them through your
Hewlett-Packard sales
representative.
The following information is
provided to answer some of the
most common questions about
the use of these parts.
Transceiver Optical
Power
Budget versus Link Length
Optical Power Budget (OPB) is
the available optical power for a
fiber optic link to accommodate
fiber cable losses plus losses due
to inline connectors, splices,
optical switches, and to provide
margin for link aging and
unplanned losses due to cable
plant reconfiguration or repair.
Figure 4 illustrates the predicted
OPB associated with the two
transceivers specified in this data
sheet at the Beginning of Life
(BOL). These curves represent
the attenuation and chromatic
plus modal dispersion losses
associated with the 62.5/125 m
and 50/125 m fiber cables only.
The area under the curve repre-
sents the remaining OPB at any
link length, which is available for
overcoming non-fiber cable
related losses.
Hewlett-Packard LED technology
has produced 800 nm LED and
1300 nm LED devices with lower
aging characteristics than
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