IC-DL IC-Haus, IC-DL Datasheet - Page 7

• Manufacturer Part Number: IC-DL
• Description: 3-CHANNEL DIFFERENTIAL LINE DRIVER
• Manufacturer: IC-Haus

PRINTED CIRCUIT BOARD LAYOUT
The thermal pad at the bottom of the package im-
proves thermal dissipation. The board layout has to
be designed so that an appropriate number of copper
vias below the thermal pad area form a good conduc-
tive path to the reverse of the board where a blank cop-
per surface of sufficient size (approx. 2 cm²) carries off
iC-DL is in a QFN28 package and comes with a eval-
uation board for test purposes. Figures 5 and 6 show
both the wiring and the top of the evaluation board.
EVALUATION BOARD
iC-DL
3-CHANNEL DIFFERENTIAL LINE DRIVER
Figure 5: Circuit diagram of the evaluation board
heat. The thermal pad is to be soldered to the board
and must be connected to GND.
To smooth the local IC supply VCC and VBx, block-
ing capacitors must be connected directly to these pins
and to GND.
Rev B1, Page 7/9