XR1002 Mimix Broadband, XR1002 Datasheet - Page 5

• Manufacturer Part Number: XR1002
• Description: GaAs MMIC Receiver
• Manufacturer: Mimix Broadband

18.0-34.0 GHz GaAs MMIC
Receiver
Mechanical Drawing
May 2006 - Rev 21-May-06
Bias Arrangement
Vg1,2
Export of this item may require appropriate export licensing from the U.S. Government. In purchasing these parts, U.S. Domestic customers accept
Bond Pad #1 (Vg1)
Bond Pad #2 (RF)
(0.079)
(0.055)
(0.016)
2.000
1.397
0.399
Vd1,2
0.0
RF
Thickness: 0.110 +/- 0.010 (0.0043 +/- 0.0004), Backside is ground, Bond Pad/Backside Metallization: Gold
2
1
0.0
Characteristic Data and Specifications are subject to change without notice. ©2006 Mimix Broadband, Inc.
2
1
Units: millimeters (inches) Bond pad dimensions are shown to center of bond pad.
3
10
Bond pad centers are approximately 0.109 (0.004) from the edge of the chip.
Bond Pad #3 (Vd1)
Bond Pad #4 (Vd2)
Mimix Broadband, Inc., 10795 Rockley Rd., Houston, Texas 77099
Dicing tolerance: +/- 0.005 (+/- 0.0002). Approximate weight: 4.152 mg.
Tel: [phone] Fax: [phone] mimixbroadband.com
4
9
(0.035)
(0.035)
0.897
0.897
their obligation to be compliant with U.S. Export Laws.
IF1
(Note: Engineering designator is 30KRP_03A)
IF2
10
All Bond Pads are 0.100 x 0.100 (0.004 x 0.004).
5
8
3
R1002
Vg3
Bond Pad #5 (IF1)
Bond Pad #6 (Vg4)
(0.059)
(0.059)
1.496
1.496
4
9
6
7
LO
(0.075)
(0.075)
1.895
1.895
5
8
Vg4
R1002
Bond Pad #7 (LO)
Bond Pad #8 (IF2)
Bypass Capacitors - See App Note [2]
RF
Vg1,2
Vd1,2
Vg3
Bond Pad #9 (Vg3)
Bond Pad #10 (Vg2)
Vg4
(0.132)
6
7
3.350
IF2
IF1
(0.063)
(0.039)
1.600
1.000
LO
Page 5 of 10
R1002