CC25-2405SS-E DENSEI-LAMBDA, CC25-2405SS-E Datasheet - Page 21

• Manufacturer Part Number: CC25-2405SS-E
• Description: Dc To Dc Converters Insulated Type, Ultra Compact Size, 1.5 To 25w Output, 5-year Warranty Period
• Manufacturer: DENSEI-LAMBDA

Soldering Conditions/Cleaning Conditions
SOLDERING CONDITIONS
DIP and SIP Models
Make sure to perform soldering to the PC board under the follow-
ing conditions.
Soldering DIP
Soldering iron
SMD Model
Lead-free solder/high-temperature reflow process
• All specifications are subject to change without notice.
Component surface temperature
245
225
180
150
˚
˚
˚
˚
1 to 3
C max.
C min.
C
C
˚
C/s
40 to 100s
260°C, for 10 seconds max.
380°C, for 3 seconds max.
1 to 4
˚
30±20s
C/s
1 to 5
˚
C/s
CLEANING CONDITIONS
It is recommended that the PC board should not be cleaned after
soldering. It, however, has already been checked that there is no
problem as a result of the following cleaning agents and test condi-
tions.
When cleaning with one of the following cleaning agents, it should
be used under these conditions. When using cleaning agent other
than the following, please consult TDK before use.
Cleaning Agents and Test Conditions
Clean Through 750H
Pine Alpha ST100S
Terpene Cleaner EC-7R
Isopropyl Alcohol
Asahi Clean AK225AES
(1) Cleaning (Agitation) 60°C/4min
(2) Rinsing (Agitation, water) 60°C/4min
(3) Rinsing (Agitation, water) Room temperature to 40°C/4min
(4) Drying 70°C/6min
(1) Cleaning (Agitation) 60°C/5min
(2) Rinsing (Agitation, water) 30°C/10min
(3) Drying 70°C/6min
(1) Cleaning (Agitation) 60°C/5min
(2) Rinsing (Agitation, IPA) 30°C/10min
(3) Drying 70°C/6min
(1) Ultrasonic cleaning 60°C/1min
(2) Cooling bath cleaning R.T./1min
(3) Vapor cleaning 83°C/1min
(1) Ultrasonic cleaning 50°C/2min
(2) Cooling bath cleaning R.T./2min
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