MAX9725 Maxim Integrated Products, MAX9725 Datasheet - Page 10

• Manufacturer Part Number: MAX9725
• Description: Stereo Headphone Amplifier
• Manufacturer: Maxim Integrated Products

The power-supply bypass capacitor (C3) lowers the
output impedance of the power supply and reduces the
impact of the MAX9725’s charge-pump switching tran-
sients. Bypass V
C1. Place C3 as close to V
Proper layout and grounding are essential for optimum
performance. Connect PGND and SGND together at a
single point on the PC board. Connect PV
and bypass with C2 to PGND. Bypass V
with C3. Place capacitors C2 and C3 as close to the
MAX9725 as possible. Route PGND, and all traces that
carry switching transients, away from SGND and the
audio signal path.
The MAX9725 does not require additional heatsinking.
The thin QFN package features an exposed paddle that
improves thermal efficiency of the package. Ensure the
exposed paddle is electrically isolated from GND and
V
1V, Low-Power, DirectDrive, Stereo Headphone
Amplifier with Shutdown
Table 1. Suggested Capacitor Manufacturers
10
Taiyo Yuden
TDK
DD
. Connect the exposed paddle to V
______________________________________________________________________________________
SUPPLIER
Power-Supply Bypass Capacitor (C3)
DD
to PGND with the same value as
DD
Layout and Grounding
as possible.
800-348-2496
847-803-6100
SS
PHONE
if necessary.
DD
SS
to PGND
to SV
SS
For the latest application details on UCSP construction,
dimensions, tape carrier information, printed circuit
board techniques, bump-pad layout , and recommend-
ed reflow temperature profile, as well as the latest infor-
mation on reliability testing results, go to Maxim’s
website at www.maxim-ic.com/ucsp for the Application
Note: UCSP—A Wafer-Level Chip-Scale Package.
TRANSISTOR COUNT: 2559
PROCESS: BiCMOS
UCSP Applications Information
847-925-0899
847-390-4405
FAX
www.t-yuden.com
www.component.tdk.com
Chip Information
WEBSITE