FPT-208P-M06 Fujitsu Microelectronics, Inc., FPT-208P-M06 Datasheet

FPT-208P-M06

Manufacturer Part Number

FPT-208P-M06

Description

THIN Shrink Small Outline Package

Manufacturer

Fujitsu Microelectronics, Inc.

Datasheet

1.FPT-208P-M06.pdf (1 pages)

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FUJITSU SEMICONDUCTOR

DATA SHEET

The contents of this document are subject to change without notice.

Customers are advised to consult with FUJITSU sales representatives before ordering.

FUJITSU is unable to assume responsibility for infringement of any patent rights or other rights of third parties arising from the use of the information or package dimensions in this document.

20-pin plastic TSSOP

LEAD No.

2003 FUJITSU LIMITED F20014S-c-3-6

(FPT-20P-M04)

FPT-20P-M04

INDEX

6.50±0.10(.256±.004)

20-pin plastic TSSOP

0.65(.026)

(FPT-20P-M04)

0.10(.004)

(.009±.003)

0.24±0.08

(.173±.004)

4.40±0.10

0.13(.005)

(.252±.008)

6.40±0.20

Note 1) *1 : Resin protrusion. (Each side : +0.15 (.006) Max).

Note 2) *2 : These dimensions do not include resin protrusion.

Note 3) Pins width and pins thickness include plating thickness.

Note 4) Pins width do not include tie bar cutting remainder.

THIN SHRINK SMALL OUTLINE PACKAGE

"A"

Mounting height

Sealing method

Package width

package length

Lead shape

(Reference)

Lead pitch

Weight

Code

(.007±.001)

0.17±0.03

Details of "A" part

(.020±.008)

(.024±.006)

Dimensions in mm (inches).

Note: The values in parentheses are reference values.

0.50±0.20

0.60±0.15

(.043±.004)

0~8 ˚

1.10±0.10

20 PIN PLASTIC

P-TSSOP20-4.4 6.5-0.65

(Mounting height)

0.25(.010)

4.40

(.002±.002)

0.05±0.05

1.20 mmMAX

Plastic mold

0.65 mm

Gullwing

0.08g

6.50 mm

(Stand off)

0212

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