MAX4599EXT Maxim, MAX4599EXT Datasheet - Page 3

• Manufacturer Part Number: MAX4599EXT
• Description: PLASTIC ENCAPSULATED DEVICES
• Manufacturer: Maxim

A. Description/Function:
B. Process:
C. Number of Device Transistors:
D. Fabrication Location:
E. Assembly Location:
F. Date of Initial Production:
A. Package Type:
B. Lead Frame:
C. Lead Finish:
D. Die Attach:
E. Bondwire:
F. Mold Material:
G. Assembly Diagram:
H. Flammability Rating:
I. Classification of Moisture Sensitivity
A. Dimensions:
B. Passivation:
C. Interconnect:
D. Backside Metallization:
E. Minimum Metal Width:
F. Minimum Metal Spacing:
G. Bondpad Dimensions:
H. Isolation Dielectric:
I. Die Separation Method:
per JEDEC standard JESD22-112:
Low-Voltage, Single-Supply, SPDT Analog Switch in SC70
S12 (Standard 1.2 micron silicon gate CMOS)
89
Philippines, Thailand or Malaysia
October, 1997
6-Pin SC70
Copper
Solder Plate
Non-Conductive Epoxy
Gold (1 mil dia.)
Epoxy with silica filler
# 05-1201-0150
Class UL94-V0
32 x 30 mils
Si
Aluminum/Si (Si = 1%)
None
1.2 microns (as drawn)
1.2 microns (as drawn)
5 mil. Sq.
SiO
Wafer Saw
California or Oregon, USA
Level 1
3
N
2
4
/SiO
2
(Silicon nitride/ Silicon dioxide)
6-Pin SOT23
Copper
Solder Plate
Non-Conductive Epoxy
Gold (1 mil dia.)
Epoxy with silica filler
#05-1201-0149
Class UL94-V0
Level 1