FT221XQ-R International Semiconductor Technologies, FT221XQ-R Datasheet - Page 40

• Manufacturer Part Number: FT221XQ-R
• Description: Specifications: Applications: * ; Interface: * ; Voltage - Supply: 3.3 V ~ 5 V ; Package / Case: 20-VFQFN Exposed Pad ; Packaging: Digi-Reel
• Manufacturer: International Semiconductor Technologies

FT221X USB 8-BIT SPI/FT1248 IC Datasheet
Version 1.2
Document No.: FT_000630 Clearance No.: FTDI# 263
10.3 QFN-20 Package Mechanical Dimensions
Figure 10.3 QFN-20 Package Dimensions
The FT221XQ is supplied in a RoHS compliant leadless QFN-20 package. The package is lead (Pb) free,
and uses a ‘green’ compound. The package is fully compliant with European Union directive 2002/95/EC.
This package is nominally 4.00mm x 4.00mm. The solder pads are on a 0.50mm pitch. The above
mechanical drawing shows the QFN-32 package. All dimensions are in millimetres.
The centre pad on the base of the FT221XQ is internally connected to GND, and the PCB should not have
signal tracks on the top layer under this device.
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