TEA6100 Philips Semiconductors (Acquired by NXP), TEA6100 Datasheet - Page 26

• Manufacturer Part Number: TEA6100
• Description: TEA6100; Fm/if System And Microcomputer-based Tuning Interface
• Manufacturer: Philips Semiconductors (Acquired by NXP)

Philips Semiconductors
PACKAGE OUTLINE
August 1987
DIP20: plastic dual in-line package; 20 leads (300 mil)
FM/IF system and microcomputer-based
tuning interface
DIMENSIONS (inch dimensions are derived from the original mm dimensions)
Note
1. Plastic or metal protrusions of 0.25 mm maximum per side are not included.
inches
UNIT
mm
SOT146-1
L
OUTLINE
VERSION
max.
Z
0.17
4.2
A
20
1
pin 1 index
0.020
min.
0.51
A
1
IEC
max.
0.13
3.2
A
2
0.068
0.051
1.73
1.30
b
e
0.021
0.015
0.53
0.38
JEDEC
b
D
1
REFERENCES
0
0.014
0.009
0.36
0.23
c
b
26.92
26.54
1.060
1.045
D
(1)
SC603
scale
EIAJ
26
5
6.40
6.22
0.25
0.24
E
(1)
2.54
0.10
11
10
b
e
1
10 mm
7.62
0.30
w
A
e
1
1
M
A
E
2
3.60
3.05
0.14
0.12
L
A
PROJECTION
EUROPEAN
8.25
7.80
0.32
0.31
M
E
c
10.0
0.39
0.33
M
8.3
Product specification
H
(e )
M
M
1
H
E
TEA6100
ISSUE DATE
0.254
0.01
92-11-17
95-05-24
w
SOT146-1
max.
0.078
2.0
Z
(1)