ATA7603 Anadigics, Inc., ATA7603 Datasheet - Page 8

• Manufacturer Part Number: ATA7603
• Description: Sonet/sdh OC-192/STM-64 Vsr, Short-Reach, Intermidiate-reach And Long-reach Receivers 10 Gb/s Ethernet Fiber Optic Receivers, Transceivers, And Transponders
• Manufacturer: Anadigics, Inc.

ATA7603
PACKAGING
The ATA7603 is provided as bare die. For optimum
performance, the die should be packaged in a
hermetic enclosure and a low inductance ground
plane should be made available for power supply
bypassing and ground bonds. When packaging the
ATA7603, the temperature of the die must be kept
below 260 °C to ensure device reliability. The
ATA7603 has backside metal but no ground vias are
connected to the backside of the die, so it is critical
to bond all of the ground pads to reduce ground
inductance. The die can be attached to the substrate
using epoxy or solder. A good thermally conductive,
silver-filled epoxy is recommended for epoxy
mounting. If solder is used for die attach, exposure
to temperatures at or above 260 °C must be limited
to ensure the device reliability. A soft silicon/rubber
tip collet should be used for die mounting, although
tweezers can be used with extreme care.
Thermosonic ball bonding, at a stage temperature
of 150 to 175 °C, with 1 to 1.3 mil gold wire, is the
recommended interconnect technique. The bond
force, time, and ultrasonic power are all critical
parameters and should be optimized to achieve the
best bonding performance. The recommended
bonding parameters are:
Stage Temperature: 175 °C
Bond Time: 15 ms
Bond Ultrasonic Power: 70 mW
Bond Force: 70 g
Bond Velocity: 60 mils/ms
8
PRELIMINARY DATA SHEET - Rev 1.0
06/2002
I
For optimal performance, the bond wire from the
photodetector to I
inductance of this connection increases beyond
1nH, more gain peaking will occur and the group
delay performance will degrade.
V
In order to achieve optimal performance, the V
supply pads must be bypassed as close to the chip
as possible with one or two high resonant
frequency, low value capacitance, MIM capacitors.
In either case, both V
connected to reduce the supply bond wire
inductance.
V
The ATA7603 provides a differential output that can
be AC or DC coupled to the next stage of the receiver.
The output bond wires should be kept below 1 nH
for the best performance. If the device is being used
in a single-ended configuration, the unused output
port must be terminated into 50 Ω.
C
In order to achieve the desired low frequency cutoff,
an external capacitor is required. A low inductance
multilayer chip capacitor of value 10 nF is
recommended.
IN
EE
OUT
EXT
Connection
Connections
Connection
and V
OUT
Connections
IN
should be around 1nH. As the
EE
bond pads need to be
EE