LM5112-SD National Semiconductor, LM5112-SD Datasheet - Page 9

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LM5112-SD

Manufacturer Part Number
LM5112-SD
Description
Tiny 7A MOSFET Gate Driver
Manufacturer
National Semiconductor
Datasheet
Thermal Performance
For LLP-6 package, the integrated circuit die is attached to
leadframe die pad which is soldered directly to the printed
circuit board. This substantially decreases the junction to
ambient thermal resistance (θ
means of heat dispersion from the IC to the ambient through
JA
). By providing suitable
(Continued)
9
exposed copper pad, which can readily dissipate heat to the
surroundings, θ
the package. The resulting Trise for the driver example
above is thereby reduced to just 5.5 degrees.
Therefore T
RISE
JA
T
is equal to
RISE
as low as 40˚C / Watt is achievable with
= 0.138 x 40 = 5.5˚C
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