AAT2848 Analogic Corporation, AAT2848 Datasheet - Page 15

• Manufacturer Part Number: AAT2848
• Manufacturer: Analogic Corporation

ChargePump
pad acts, thermally, to transfer heat from the chip and,
electrically, as a ground connection.
The junction-to-ambient thermal resistance (θ
connection can be significantly reduced by following a
couple of important PCB design guidelines. The PCB area
directly underneath the package should be plated so
that the exposed paddle can be mated to the top layer
PCB copper during the reflow process. Multiple copper
plated thru-holes should be used to electrically and ther-
mally connect the top surface pad area to additional
ground plane(s).
2848.2008.05.1.0
Manufacturer
Taiyo Yuden
Murata
AVX
TDK
TM
High-Current Charge Pump For Backlight Display and Flash Applications
GRM188R61C105K
GRM188R61A225K
C1608X5R1C225K
C1608X5R1A475K
C1608X5R1E105K
LMK107BJ475KA
Part Number
Table 3: Suggested Capacitor Components.
0603ZD105K
0603ZD225K
w w w . a n a l o g i c t e c h . c o m
JA
) for the
The chip ground is internally connected to both the
exposed pad and to the AGND and PGND pins. It is good
practice to connect the GND pins to the exposed pad
area with traces.
The flying capacitors (C1 and C2), input capacitor (C4),
and output capacitor (C5) should be connected as close
as possible to the IC. In addition to the external passive
components being placed as close as possible to the IC,
all traces connecting the AAT2848 should be as short
and wide as possible to minimize path resistance and
potential coupling.
Value
2.2μF
2.2μF
4.7μF
2.2μF
4.7μF
1μF
1μF
1μF
Voltage
10
10
25
16
10
16
10
10
PRODUCT DATASHEET
Temp. Co.
AAT2848
X5R
X5R
X5R
X5R
Case
0603
0603
0603
0603
15