LM360M National Semiconductor, LM360M Datasheet - Page 2

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LM360M

Manufacturer Part Number
LM360M
Description
High Speed Differential Comparator
Manufacturer
National Semiconductor
Datasheet

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Operating Conditions
Input Offset Voltage
Input Offset Current
Input Bias Current
Output Resistance (Either Output)
Response Time
Response Time Difference between Outputs
Input Resistance
Input Capacitance
Average Temperature Coefficient of
Input Offset Voltage
Average Temperature Coefficient of
Input Offset Current
Common Mode Input Voltage Range
Differential Input Voltage Range
Output High Voltage (Either Output)
Output Low Voltage (Either Output)
Positive Supply Current
Negative Supply Current
(T
Electrical Characteristics
Note 2: Response time measured from the 50% point of a 30 mVp-p 10 MHz sinusoidal input to the 50% point of the output.
Note 3: Response time measured from the 50% point of a 2 Vp-p 10 MHz sinusoidal input to the 50% point of the output.
Note 4: Response time measured from the start of a 100 mV input step with 5 mV overdrive to the time when the output crosses the logic threshold.
Note 5: Typical thermal impedances are as follows:
Note 6: The device may be damaged if used beyond the maximum ratings.
Note 7: Measurements are made in AC Test Circuit, Fanout = 1
Note 8: Refer to RETS 160X for LM160H, LM160J-14 and LM160J military specifications.
Absolute Maximum Ratings
If Military/Aerospace specified devices are required,
please contact the National Semiconductor Sales Office/
Distributors for availability and specifications.
Positive Supply Voltage
Negative Supply Voltage
Peak Output Current
Differential Input Voltage
Input Voltage
ESD Tolerance (Note 9)
Supply Voltage V
Supply Voltage V
(t
(t
(t
(t
Cavity DIP (J):
Molded DIP (N):
Operating Temperature Range
MIN
pd
pd
pd
pd
LM160
LM360
of +V
of +V
of +V
of −V
T
A
IN1
IN2
IN1
IN1
) − (t
) − (t
) − (t
) − (t
T
MAX
Parameter
pd
pd
pd
pd
CC
CC
)
of −V
of −V
of +V
of −V
+
jA
jA
IN2
IN1
IN2
IN2
)
)
)
)
135˚C/W
130˚C/W
−55˚C to +125˚C
V
(Notes 6, 8)
0˚C to +70˚C
R
V
T
T
T
T
T
T
T
f = 1 MHz
f = 1 MHz
R
V
I
I
V
V
+
OUT
SINK
A
A
A
A
A
A
A
OUT
S
S
S
S
S
= 25˚C, V
= 25˚C, V
= 25˚C, V
= 25˚C (Notes 2, 7)
= 25˚C (Notes 2, 7)
= 25˚C (Notes 2, 7)
= 25˚C (Notes 2, 7)
= 50
=
=
=
V
= −320 µA, V
IN
200
= 6.4 mA
±
±
±
20 mA
1600V
= V
6.5V
6.5V
6.5V
±
Header (H)
+8V
−8V
5V
OH
V
Conditions
S
S
S
2
=
=
=
±
±
±
S
5V (Notes 2, 7)
5V (Notes 3, 7)
5V (Notes 4, 7)
Storage Temperature Range
Lead Temperature
Soldering Information
=
See AN-450 “Surface Mounting Methods and Their Effect
(Soldering, 10 sec.)
Dual-In-Line Package
Small Outline Package
±
on Product Reliability” for other methods of soldering
Soldering (10 seconds)
Vapor Phase (60 seconds)
Infrared (15 seconds)
4.5V
jC
jA
surface mount devices.
165˚C/W
67˚C/W
25˚C/W
−4.5
Min
4.5
2.4
±
±
4
5
±
0.25
Typ
100
0.5
−5
13
12
14
17
18
−9
4.5
5
2
5
2
2
2
2
3
8
7
3
(Still Air)
(400 LF/min Air Flow)
−65˚C to +150˚C
Max
−6.5
−16
6.5
0.4
20
25
20
32
5
3
260˚C
260˚C
215˚C
220˚C
Units
µV/˚C
nA/˚C
mV
mA
mA
µA
µA
k
ns
ns
ns
ns
ns
ns
ns
pF
V
V
V
V
V
V

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