ACS10D Intersil Corporation, ACS10D Datasheet - Page 6
![no-image](/images/manufacturer_photos/0/3/342/intersil_corporation_sml.jpg)
ACS10D
Manufacturer Part Number
ACS10D
Description
Radiation Hardened Triple Three-input NAND Gate
Manufacturer
Intersil Corporation
Datasheet
1.ACS10D.pdf
(8 pages)
Die Characteristics
DIE DIMENSIONS:
METALLIZATION:
GLASSIVATION:
Metallization Mask Layout
88 mils x 88 mils
2,240mm x 2,240mm
Type: AlSiCu
Metal 1 Thickness: 6.75k
Metal 2 Thickness: 9k
Type: SiO
Thickness: 8k
A2 (03)
B2 (04)
C2 (05)
2
NC
Å
1k
Å
Å
(Min), 11k
Å
(Min), 8.25k
Å
(Max)
Å
(Max)
(02)
(06)
B1
Y2
ACS10MS
(01)
GND
A1
(07)
ACS10MS
6
DIE ATTACH:
WORST CASE CURRENT DENSITY:
BOND PAD SIZE:
VCC
(14)
(08)
Y3
Material: Silver Glass or JM 7000 after 7/1/95
< 2.0 x 10
> 4.3 mils x 4.3 mils
> 110 m x 110 m
(13)
C1
(09)
A3
5
A/cm
2
Spec Number
(12) Y1
(11) C3
NC
(10) B3
518814