BAS40-04thruBAS40-06 General Semiconductor, BAS40-04thruBAS40-06 Datasheet
BAS40-04thruBAS40-06
Manufacturer Part Number
BAS40-04thruBAS40-06
Description
Schottky Diodes
Manufacturer
General Semiconductor
Datasheet
1.BAS40-04THRUBAS40-06.pdf
(2 pages)
Document Number 88129
8-May-02
Maximum Ratings and Thermal Characteristics
Parameter
Repetitive Peak Reverse Voltage
Forward Continuous Current at T
Surge Forward Current at t
Power Dissipation
Thermal Resistance Junction to Ambiant Air
Junction Temperature
Storage Temperature Range
Note:
(1) Device on fiberglass substrate, see layout on next page.
BAS40
Marking: 43
BAS40-05
Marking: 45
.016 (0.4)
.037(0.95) .037(0.95)
1
.016 (0.4)
.122 (3.1)
.110 (2.8)
TO-236AB (SOT-23)
(1)
3
at T
.016 (0.4)
Dimensions in inches and (millimeters)
2
amb
p
< 1 s, T
= 25°C
Top View
Top View
amb
Top View
amb
= 25°C
= 25°C
.102 (2.6)
.094 (2.4)
Schottky Diodes
BAS40-04
Marking: 44
BAS40-06
Marking: 46
Symbol
R
V
I
Features
• These diodes feature very low turn-on voltage and fast
• These devices are protected by a PN junction guard
Mechanical Data
Case: SOT-23 Plastic Package
Weight: approx. 0.008g
Packaging Codes/Options:
P
thJA
FSM
RRM
T
T
(T
I
switching.
ring against excessive voltage, such as electrostatic dis-
charges.
F
tot
j
S
A
E8/10K per 13” reel (8mm tape), 30K/box
E9/3K per 7” reel (8mm tape), 30K/box
= 25°C unless otherwise noted)
0.037 (0.95)
0.079 (2.0)
Mounting Pad Layout
–55 to +150
BAS40 thru BAS40-06
Vishay Semiconductors
Value
200
600
200
430
formerly General Semiconductor
150
40
0.031 (0.8)
(1)
(1)
(1)
(1)
0.035 (0.9)
0.037 (0.95
www.vishay.com
°C/W
Unit
mW
mA
mA
°C
°C
V
1
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BAS40-04thruBAS40-06 Summary of contents
Page 1
... A Symbol V RRM = 25° 25°C I amb FSM P tot R thJA BAS40 thru BAS40-06 Vishay Semiconductors formerly General Semiconductor Mounting Pad Layout 0.031 (0.8) 0.035 (0.9) 0.079 (2.0) 0.037 (0.95 0.037 (0.95) Value 40 (1) 200 (1) 600 (1) 200 (1) 430 150 –55 to +150 ...
Page 2
... BAS40 thru BAS40-06 Vishay Semiconductors formerly General Semiconductor Electrical Characteristics Parameter Reverse Breakdown Voltage Leakage Current Forward Voltage Capacitance Reverse Recovery Time Note: (1) Device on fiberglass substrate, see layout. Layout for R test thJA Thickness: Fiberglass 0.059 in. (1.5 mm) Copper leads 0.012 in. (0.3 mm) www.vishay.com ...