APTGF90SK60T3AG Microsemi Corporation, APTGF90SK60T3AG Datasheet - Page 3
APTGF90SK60T3AG
Manufacturer Part Number
APTGF90SK60T3AG
Description
Buck Chopper Npt Igbt Power Module Power Module
Manufacturer
Microsemi Corporation
Datasheet
1.APTGF90SK60T3AG.pdf
(5 pages)
Temperature sensor NTC
Thermal and package characteristics
Symbol Characteristic
Torque
Symbol
∆R
SP3 Package outline
V
R
T
∆B/B
B
Wt
T
T
ISOL
R
STG
thJC
25
25/85
C
J
25
/R
25
Junction to Case Thermal Resistance
RMS Isolation Voltage, any terminal to case t =1 min, I isol<1mA, 50/60Hz
Operating junction temperature range
Storage Temperature Range
Operating Case Temperature
Mounting torque
Package Weight
Characteristic
Resistance @ 25°C
T
25
= 298.15 K
See application note 1901 - Mounting Instructions for SP3 Power Modules on www.microsemi.com
28
1
(dimensions in mm)
R
T
=
exp
(see application note APT0406 on www.microsemi.com for more information).
⎡
⎢
⎣
B
25
/
85
R
⎛
⎜ ⎜
⎝
25
T
1
25
−
T
1
⎞
⎟ ⎟
⎠
www.microsemi.com
⎤
⎥
⎦
T: Thermistor temperature
R
T
: Thermistor value at T
17
12
To heatsink
APTGF90SK60T3AG
T
C
=100°C
Diode
IGBT
M4
2500
Min
Min
-40
-40
-40
2.5
3952
Typ
Typ
50
5
4
Max
0.24
0.52
Max
150
125
100
110
4.7
°C/W
Unit
Unit
N.m
kΩ
°C
%
K
%
V
g
3 – 5