VJ2225 Vishay, VJ2225 Datasheet - Page 8

• Manufacturer Part Number: VJ2225
• Description: Surface Mount Multilayer Ceramic Chip Capacitor Solutions For Boardflex Sensitive Applications
• Manufacturer: Vishay

www.vishay.com
104
VJ OMD - X7R
Vishay Vitramon
BOARDFLEX SENSITIVE APPLICATIONS - SOLUTION:
A predominant failure mode in multilayer ceramic chip capacitors is cracking caused by board flexure. Cracks can then create a
path for current to pass from one electrode through the dielectric to an opposing electrode or from the terminations at one end of
the MLCC through the dielectric to an opposing electrode. This may subsequently result in capacitance loss, leakage - low
Insulation Resistance (IR) - and/or more seriously, high current shorts. A short circuit condition in the surface mounted capacitors
can cause further failures of downstream components. Vishay’s Open Mode Design Capacitors (VJ OMD - Cap series) reduce
the risk of these destructive conditions through MLCC designs that prevent board flexure cracks reaching the opposing electrode.
VJ OMD - Cap MLCCs reduce the risk of early field failures associated with board flex cracks. However, it is important to note
that even in the open mode designs the presence of flexure related cracks can cause capacitance loss leading to localized
stresses on the parts. eventually, depending on the application environment, including such factors and high voltage pulse
frequency and thermal cycling this may lead to internal breakdown of the component.
POLYMER TERMINATION
Polymer termination provides additional protection against board flexure damage by absorbing greater mechanical and thermal
stresses. Componenets can be packaged, transported, stored and handled the same standard terminated product. Wave and
reflow soldering of MLCC does not require modification to equipment and/or process. Polymer termination greatly reduces the
risk of mechanical cracking however it does not completely eliminate.
STANDARD TERMINATION
Exposed Electrodes = Electrical Short
Surface Mount Multilayer Ceramic Chip Capacitor Solutions
100 %
60 %
50 %
90 %
80 %
70 %
40 %
30 %
20 %
10 %
0 %
0.0
For technical questions, contact: [e-mail]
for Boardflex Sensitive Applications
1.0
BEND TEST RESULTS 2220 CASE SIZE
Standard Termination
Polymer Termination
Log. (Standard Termination)
Log. (Polymer Termination)
2.0
BOARD FLEXURE in mm
3.0
4.0
OMD CAP PLUS POLYMER TERMINATION
No Exposed Electrodes = No Electrical Short
5.0
6.0
7.0
8.0
9.0
Document Number: 45046
Revision: 02-Mar-09