NL17SZ04 ON Semiconductor, NL17SZ04 Datasheet - Page 6
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NL17SZ04
Manufacturer Part Number
NL17SZ04
Description
Single Inverter
Manufacturer
ON Semiconductor
Datasheet
1.NL17SZ04.pdf
(6 pages)
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PUBLICATION ORDERING INFORMATION
LITERATURE FULFILLMENT:
Literature Distribution Center for ON Semiconductor
P.O. Box 61312, Phoenix, Arizona 85082−1312 USA
Phone: 480−829−7710 or 800−344−3860 Toll Free USA/Canada
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Email: orderlit@onsemi.com
ON Semiconductor and
to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability
arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages.
“Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All
operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights
nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications
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5
1
e
−X−
D
2
4
3
are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice
b
0.08 (0.003)
−Y−
5 PL
E
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
M
X
0.0531
Y
1.35
N. American Technical Support: 800−282−9855 Toll Free
USA/Canada
Japan: ON Semiconductor, Japan Customer Focus Center
A
2−9−1 Kamimeguro, Meguro−ku, Tokyo, Japan 153−0051
Phone: 81−3−5773−3850
PACKAGE DIMENSIONS
SOLDERING FOOTPRINT*
5−LEAD PACKAGE
http://onsemi.com
0.0197
H
CASE 463B−01
c
0.0118
0.5
L
E
XV5 SUFFIX
0.3
0.0394
NL17SZ04
SOT−553
ISSUE B
1.0
0.0197
0.5
6
NOTES:
DIM
H
1. DIMENSIONING AND TOLERANCING PER
2. CONTROLLING DIMENSION: MILLIMETERS
3. MAXIMUM LEAD THICKNESS INCLUDES
SCALE 20:1
A
b
c
D
E
e
L
0.0177
E
0.45
ANSI Y14.5M, 1982.
LEAD FINISH THICKNESS. MINIMUM LEAD
THICKNESS IS THE MINIMUM THICKNESS
OF BASE MATERIAL.
MIN
0.50
0.17
0.08
1.50
1.10
0.10
1.50
MILLIMETERS
0.50 BSC
inches
NOM
0.55
0.22
0.13
1.60
1.20
0.20
1.60
mm
STYLE 1:
PIN 1. BASE 1
2. EMITTER 1/2
3. BASE 2
4. COLLECTOR 2
5. COLLECTOR 1
MAX
0.60
0.27
0.18
1.70
1.30
0.30
1.70
ON Semiconductor Website: http://onsemi.com
Order Literature: http://www.onsemi.com/litorder
For additional information, please contact your
local Sales Representative.
0.020
0.007
0.003
0.059
0.043
0.004
0.059
MIN
0.020 BSC
INCHES
0.022
0.009
0.005
0.063
0.047
0.008
0.063
NOM
STYLE 2:
PIN 1. CATHODE
2. ANODE
3. CATHODE
4. CATHODE
5. CATHODE
0.024
0.011
0.007
0.067
0.051
0.012
0.067
MAX
NL17SZ04/D