VSML3710 Vishay, VSML3710 Datasheet - Page 5

• Manufacturer Part Number: VSML3710
• Description: High Power Infrared Emitting Diode, 940 Nm Rohs Compliant, Released For Lead Pb -free Solder Process
• Manufacturer: Vishay

Solder Profile
Drypack
Devices are packed in moisture barrier bags (MBB) to
prevent the products from moisture absorption during
transportation and storage. Each bag contains a des-
iccant.
Floor Life
Floor life (time between soldering and removing from
MBB) must not exceed the time indicated on MBB
label:
Floor Life: 4 weeks
Conditions: T
Moisture Sensitivity Level 2a, acc. to J-STD-020B.
Drying
In case of moisture absorption devices should be
baked before soldering. Conditions see J-STD-020 or
Label. Devices taped on reel dry using recommended
conditions 192 h at 40 °C (+ 5 °C), RH < 5 %.
Document Number 81300
Rev. 1.2, 25-Jan-07
Figure 11. Lead (Pb)-free Reflow Solder Profile acc. J-STD-020B
Figure 12. Double Wave Solder Profile for Opto Components
19841
300
250
200
150
100
50
100
300
250
200
150
0
50
0
0
0
100 °C...130 °C
TTW Soldering
235 °C...260 °C
255 °C
240 °C
217 °C
for Preconditioning acc. to JEDEC, Level 2a
255°C
max. Ramp Up 3 °C/s
ca. 200 K/s
first wave
50
amb
50
forced cooling
5 s
< 30 °C, RH < 60 %
max. 120 s
2 K/s
100
(acc. to CECC00802)
100
Time (s)
Time (s)
second
ca. 2 K/s
wave
150
150
dotted line: process limits
max. Ramp Down 6 °C/s
200
max. 100 s
Lead Temperature
ca. 5 K/s
max. 30 s
full line: typical
200
250
max. 260 °C
245 °C
948626-1
300
250
Tape and Reel
PLCC-2 components are packed in antistatic blister
tape (DIN IEC (CO) 564) for automatic component
insertion. Cavities of blister tape are covered with
adhesive tape.
Adhesive Tape
1.6
1.4
Figure 14. Tape Dimensions in mm for PLCC-2
Component Cavity
4.1
3.9
Figure 13. Blister Tape
3.5
3.1
2.05
1.95
Vishay Semiconductors
4.1
3.9
VSML3710
1.85
1.65
3.6
3.4
5.75
5.25
8.3
7.7
Blister Tape
www.vishay.com
0.25
2.2
2.0
94 8668
94 8670
4.0
3.6
5