HLMP-CB13 Avago Technologies, HLMP-CB13 Datasheet - Page 8
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HLMP-CB13
Manufacturer Part Number
HLMP-CB13
Description
Precision Optical Performance Blue And Green
Manufacturer
Avago Technologies
Datasheet
1.HLMP-CB13.pdf
(10 pages)
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Example of Wave Soldering Temperature Profile for TH LED
Ammo Packs Drawing
0.7087±0.0197
Note: The ammo-packs drawing is applicable for packaging option -DD & -ZZ and regardless standoff or non-standoff.
18.00±0.50
250
200
150
100
50
0
0.3593±0.0246
9.125±0.625
10
0.25±0.0512
6.35±1.30
20
0.50±0.0118
12.70±0.30
30
PREHEAT
TURBULENT WAVE
0.50±0.0394
12.70±1.00
CATHODE
40
TIME (MINUTES)
0.0276±0.0079
50
0.70±0.20
60
A
VIEW A-A
70
A
LAMINAR WAVE
80
HOT AIR KNIFE
90
∅
4.00±0.20TYP.
0.1575±0.008
100
Recommended solder:
Sn63 (Leaded solder alloy)
SAC305 (Lead free solder alloy)
Flux: Rosin flux
Solder bath temperature:
245°C± 5°C (maximum peak
temperature = 250°C)
Dwell time: 1.5 sec - 3.0 sec
(maximum = 3sec)
Note: Allow for board to be sufficiently
cooled to room temperature before
exerting mechanical force.
0.807±0.039
20.50±1.00