NJL6201R-1 New Japan Radio Co.,Ltd, NJL6201R-1 Datasheet - Page 4

• Manufacturer Part Number: NJL6201R-1
• Description: High Speed Pin Photo Diode
• Manufacturer: New Japan Radio Co.,Ltd

NJL6201R-1
1. Soldering to actual circuit board
2. Cleaning
3. Attention in handling
4. Storage
- 4 -
Room
Temp.
Avoid washing of the device after soldering by reflow method.
In order to prevent from degradation of this device in moisturing at reflow method, so that this device is contained in deaeration
packaging. So that mount the device as short as possible after opening the envelope.
260°C
230°C
220°C
180°C
150°C
Soldering condition
Soldering Method
1) Reflow Method
2) Reflow Method (In case of infrared heating)
3) The other method
1) Treat not to touch the lens surface.
2) Avoid dust and any other foreign materials (paint, bonding material, etc.) on the lens surface.
- Heated condition of plastic package.
Lower than 260 °C of maximum surface temperature
- Temperature profile
- Avoid direct irradiation to the plastic package because it is mold resin, absorbs the Infrared Radiation and its surface
Recommended temperature profile of its method.
Soldering to be done within twice under this condition.
temperature will be higher than lead itself.
Avoid rapid heating up like dipping the devices directly into the melting solder or vapor phase method ( VPS).
If the device is heated to high temperature and kept in its condition for longer time, it would affect to its reliability.
It is necessary to solder in short time as soon as possible.
a
: Same to the above
PRECAUTION FOR HANDLING
b
c
f
e
d
g
The temperature indicates at the surface of mold
package
a : Temperature ramping rate
b : Pre-heating temperature
c : Temperature ramping rate
d : 220°C or higher time
e : 230°C or higher time
f : Peak temperature
g : Temperature ramping rate
time
: 1 to 4°C/s
: 150 to 180°C
: 60 to 120s
: 1 to 4°C /s
: Shorter than 60s
: Shorter than 40s
: Lower than 260°C
: 1 to 6°C /s
Ver.2005-01-20