2DAA-F6R Bourns, Inc., 2DAA-F6R Datasheet - Page 2

• Manufacturer Part Number: 2DAA-F6R
• Description: Integrated Passive & Active Device
• Manufacturer: Bourns, Inc.

This is a silicon-based device and is packaged using chip scale packaging technology. Solder bumps, formed on the silicon die,
provide the interconnect medium from die to PCB. The bumps are arranged on the die in a regular grid formation. The grid pitch is
0.5 mm and the dimensions for the packaged device are shown below.
Reliability data is gathered on an ongoing basis for Bourns
“Package level” testing of the integrity of the solder joint is carried out on an independent Daisy-Chain test device. A 25-Pin Daisy
Chain component is available from Bourns for this purpose (part number 2TAD-C25R). This is a 5 x 5 array featuring 0.5 mm pitch
solder bumps. The Distance to Neutral Point (DNP) on that component is larger than that of the 2DAA-F6R and is thus deemed
suitable for Thermal Cycle testing.
“Silicon level” reliability performance is based on similarity to other integrated passive CSP devices from Bourns.
Mechanical Characteristics
Reliability Data
Overshoot and Clamping Voltage Response
2DAA-F6R - Integrated Passive & Active Device
(0.016 - 0.017)
(0.019 - 0.021)
0.414 - 0.424
0.490 - 0.524
35
25
15
-5
5
-90,000 ns
ESD Test Pulse - 25 kilovolt, 1/30 ns (waveshape)
®
Integrated Passive and Active Devices.
(0.006 - 0.002)
0.15 - 0.005
(0.007 - 0.011)
0.180 - 0.280
10,000 ns
(0.020)
0.50
(0.020)
0.50
DIA.
Customers should verify actual device performance in their specific applications.
(0.038 - 0.040)
A1
A2
A3
0.965 - 1.015
110,000 ns
B1
B3
B2
(0.020)
0.50
(0.058 - 0.060)
Specifications are subject to change without notice.
1.475 - 1.525
(0.007 - 0.011)
0.180 - 0.280
DIMENSIONS =
MILLIMETERS
(INCHES)