DIM300WHS17-A000 Dynex Semiconductor, DIM300WHS17-A000 Datasheet - Page 7
DIM300WHS17-A000
Manufacturer Part Number
DIM300WHS17-A000
Description
Half Bridge Igbt Module
Manufacturer
Dynex Semiconductor
Datasheet
1.DIM300WHS17-A000.pdf
(8 pages)
PACKAGE DETAILS
For further package information, please visit our website or contact Customer Services. All dimensions in mm, unless stated otherwise.
DO NOT SCALE.
Caution: This device is sensitive to electrostatic discharge. Users should follow ESD handling procedures.
www.dynexsemi.com
6(G
7(E
1(E1C2)
2
2
)
)
Module outline type code: W
Fig. 11 Package details
Nominal weight: 420g
2(E2)
3(C1)
4(G
5(E
1
1
)
)
DIM300WHS17-A000
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