BS801C Holtek Semiconductor Inc., BS801C Datasheet
BS801C
Available stocks
Related parts for BS801C
BS801C Summary of contents
Page 1
... Auto-calibration High reliability touch detections High PSRR General Description The BS801C/02C/04C/06C/08C are a range key touch key devices which can detect human body contact using external touch pads. The high level of de- vice integration enable applications to be implemented with a minimum number of external components. ...
Page 2
... Internal circuitry ensures that this pull high resistor will not BS804C consume current even if the input is low. Open: Level-Hold output Low: Toggle output Note important that the logic level of the OKW and LHF pins do not change state after power-on. Rev. 1.00 BS801C/02C/04C/06C/08C Description Description 2 December 2, 2009 ...
Page 3
... Symbol Parameter V Operating Voltage DD I Operating Current DD V Input High Voltage IH V Input Low Voltage IL I Sink Current OL R Pull-high Resistance PH Rev. 1.00 BS801C/02C/04C/06C/08C +6.0V Storage Temperature ........................... 125 C SS +0.3V Operating Temperature .......................... Total.............................................................. 80mA OH Test Conditions Min. V Conditions DD 2 load 0. ...
Page 4
... Operating Voltage DD Operating Current - I DD1 One-key State Operating Current - I DD2 Any-Key State V Input High Voltage IH V Input Low Voltage IL I Sink Current OL R Pull-high Resistance PH Rev. 1.00 BS801C/02C/04C/06C/08C Test Conditions Min. V Conditions DD 2 load 3V No load 0. =0. Test Conditions Min ...
Page 5
... OKW pin will be automatically read. If the OKW pin is low then the device will enter the Any-key State and if the pin is floating the device will enter the One-key State. As the BS801C and BS802C devices do not have an OKW pin they will always operate in the Any-key State. ...
Page 6
... Touch Key Outputs All Kout pins have NMOS structures to allow easy inter- facing to external devices with different operating volt- ages. The BS801C, BS802 and BS804C devices can have their outputs configured to operate with either Level-Hold or Toggle type. The output type is deter- mined by the status of the LHF pin which is read during power-on ...
Page 7
... This action will tem- SCD porarily disable the device and enable it to receive the Rev. 1.00 BS801C/02C/04C/06C/08C command from the MCU. Any command sent to the device from the MCU will override the original power on configuration setup. SCD Device Setup ...
Page 8
... Higher Cs values will result in higher levels of sensitivity. Recommended values for Cs are between 0pF and 10pF. Rev. 1.00 BS801C/02C/04C/06C/08C Touch key pad size Larger touch key sizes will increase sensitivity and of course vice-versa, small electrode sizes will decrease sensitivity. ...
Page 9
... Note: If the output is connected to an MCU input with an internal pull high resistor then the pull high resistor on the ap- plication circuit is not required. Rev. 1.00 BS801C/02C/04C/06C/08C VDD VDD 0.1uF R VDD Kout LHF BS801C VDD VDD 0.1uF R VDD Kout0 R VDD Kout1 LHF BS802C VDD VDD ...
Page 10
... Touch Key0 . . . Touch Key7 Cs 0pF~ 10pF Note: If the output is connected to an MCU input with an internal pull high resistor then the pull high resistor on the ap- plication circuit is not required. Rev. 1.00 BS801C/02C/04C/06C/08C VDD VDD Key0 . 0.1uF . . R Key5 VDD Kout0 Cref . R . VDD ...
Page 11
... Package Information 8-pin SOP (150mil) Outline Dimensions MS-012 Symbol Rev. 1.00 BS801C/02C/04C/06C/08C Dimensions in mil Min. Nom. 228 150 12 188 Max. 244 157 20 197 December 2, 2009 ...
Page 12
... NSOP (150mil) Outline Dimensions MS-012 Symbol Rev. 1.00 BS801C/02C/04C/06C/08C Dimensions in mil Min. Nom. 228 150 12 386 Max. 244 157 20 394 December 2, 2009 ...
Page 13
... SOP (300mil) Outline Dimensions MS-013 Symbol Rev. 1.00 BS801C/02C/04C/06C/08C Dimensions in mil Min. Nom. 393 256 12 496 Max. 419 300 20 512 104 December 2, 2009 ...
Page 14
... SSOP (150mil) Outline Dimensions Symbol Rev. 1.00 BS801C/02C/04C/06C/08C Dimensions in mil Min. Nom. 228 150 8 335 Max. 244 158 12 347 December 2, 2009 ...
Page 15
... SOT23-6 Outline Dimensions Symbol Rev. 1.00 BS801C/02C/04C/06C/08C Dimensions in mm Min. Nom. 1.0 0.7 0.35 0.1 2.7 1.4 1.9 2.6 0. Max. 1.3 0.1 0.9 0.50 0.25 3.1 1.8 3.0 9 December 2, 2009 ...
Page 16
... Key Slit Width T1 Space Between Flange T2 Reel Thickness SOP 16N (150mil) Symbol Description A Reel Outer Diameter B Reel Inner Diameter C Spindle Hole Diameter D Key Slit Width T1 Space Between Flange T2 Reel Thickness Rev. 1.00 BS801C/02C/04C/06C/08C Dimensions in mm 330.0 1.0 100.0 1.5 +0.5/-0.2 13.0 2.0 0.5 +0.3/-0.2 12.8 18.2 0.2 Dimensions in mm 330.0 1.0 100.0 1.5 +0.5/-0.2 13.0 2.0 0.5 +0.3/-0.2 16.8 22.2 0.2 16 December 2, 2009 ...
Page 17
... Key Slit Width T1 Space Between Flange T2 Reel Thickness SOT23-6 Symbol Description A Reel Outer Diameter B Reel Inner Diameter C Spindle Hole Diameter D Key Slit Width T1 Space Between Flange T2 Reel Thickness Rev. 1.00 BS801C/02C/04C/06C/08C Dimensions in mm 330.0 1.0 100.0 1.5 +0.5/-0.2 13.0 2.0 0.5 +0.3/-0.2 24.8 30.2 0.2 Dimensions in mm 330.0 1.0 100.0 1.5 +0.5/-0.2 13.0 2.0 0.5 +0.3/-0.2 16.8 22.2 0.2 Dimensions in mm 178.0 1.0 62 ...
Page 18
... Description W Carrier Tape Width P Cavity Pitch E Perforation Position F Cavity to Perforation (Width Direction) D Perforation Diameter D1 Cavity Hole Diameter P0 Perforation Pitch P1 Cavity to Perforation (Length Direction) A0 Cavity Length B0 Cavity Width K0 Cavity Depth t Carrier Tape Thickness C Cover Tape Width Rev. 1.00 BS801C/02C/04C/06C/08C Dimensions in mm +0.3/-0.1 12.0 8.0 0.1 1.75 0.1 5.5 0.1 1.55 0.1 +0.25/-0.00 1.50 4.0 0.1 2.0 0.1 6.4 0.1 5.2 0.1 2.1 0.1 0.30 0.05 9.3 0.1 Dimensions in mm 16.0 0.3 8.0 0.1 1.75 0.1 7.5 0.1 +0.10/-0.00 1.55 +0.25/-0.00 1.50 4.0 0.1 2.0 0.1 6 ...
Page 19
... Description W Carrier Tape Width P Cavity Pitch E Perforation Position F Cavity to Perforation (Width Direction) D Perforation Diameter D1 Cavity Hole Diameter P0 Perforation Pitch P1 Cavity to Perforation (Length Direction) A0 Cavity Length B0 Cavity Width K0 Cavity Depth t Carrier Tape Thickness C Cover Tape Width Rev. 1.00 BS801C/02C/04C/06C/08C Dimensions in mm +0.3/-0.1 24.0 12.0 0.1 1.75 0.10 11.5 0.1 +0.1/-0.0 1.5 +0.25/-0.00 1.50 4.0 0.1 2.0 0.1 10.8 0.1 13.3 0.1 3.2 0.1 0.30 0.05 21.3 0.1 Dimensions in mm +0.3/-0.1 16.0 8.0 0.1 1.75 0.10 7.5 0.1 +0.1/-0.0 1.5 +0.25/-0.00 1.50 4 ...
Page 20
... Description W Carrier Tape Width P Cavity Pitch E Perforation Position F Cavity to Perforation (Width Direction) D Perforation Diameter D1 Cavity Hole Diameter P0 Perforation Pitch P1 Cavity to Perforation (Length Direction) A0 Cavity Length B0 Cavity Width K0 Cavity Depth t Carrier Tape Thickness C Cover Tape Width Rev. 1.00 BS801C/02C/04C/06C/08C Dimensions in mm 8.0 0.3 4.0 0.1 1.75 0.10 3.50 0.05 +0.1/-0.0 1.5 +0.1/-0.0 1.5 4.0 0.1 2.00 0.05 3.15 0.10 3.2 0.1 1.4 0.1 0.20 0.03 5.3 0.1 20 December 2, 2009 ...
Page 21
... Holtek s products are not authorized for use as critical components in life support devices or systems. Holtek reserves the right to alter its products without prior notification. For the most up-to-date information, please visit our web site at http://www.holtek.com.tw. Rev. 1.00 BS801C/02C/04C/06C/08C 21 December 2, 2009 ...