EM5060 EM Microelectronic, EM5060 Datasheet - Page 4

• Manufacturer Part Number: EM5060
• Description: Low Voltage Cmos Driver Circuit For Motor, Bus And Led Driver
• Manufacturer: EM Microelectronic

Functional Description
Chip Information
Ordering Information
EM5060 is available in two versions:
When ordering, please specify the complete Part Number below.
Copyright © 2008, EM Microelectronic-Marin SA
04/08 – rev. C
Part Number
EM5060V1WP11
EM5060V1WS11
EM5060V2WP11
EM5060V2WS11
EM Microelectronic-Marin SA (EM) makes no warranty for the use of its products, other than those expressly contained in the Company's
standard warranty which is detailed in EM's General Terms of Sale located on the Company's web site. EM assumes no responsibility for any
errors which may appear in this document, reserves the right to change devices or specifications detailed herein at any time without notice,
and does not make any commitment to update the information contained herein. No licenses to patents or other intellectual property of EM are
granted in connection with the sale of EM products, expressly or by implications. EM's products are not authorized for use as components in
life support devices or systems.
•
•
In
Version V1 contains four input/outputs (INPUTS = IN1, IN2, IN3, IN4 ; OUTPUTS = OUT1, OUT2, OUT3, OUT4).
Version V2 contains two input/outputs (INPUTS = IN1, IN2 ; OUTPUTS = OUT1, OUT2).
Chip size is x = 1447 by y = 1295 microns or x = 57 by y = 51 mils
NOTE: The origin (0,0) is the lower left coordinate of center pads
N.C.
All dimensions in microns
R
ANTI-CURRENT
INVERTER
The lower left corner of the chip shows distances
Not connected
HIZ
X=0, Y= 508
X= -160
Y= -159
Version
V1
V1
V2
V2
VGP
VGN
Die & Delivery Form
Die in waffle pack, 11 mils thickness
Sawn wafer, 11 mils thickness
Die in waffle pack, 11 mils thickness
Sawn wafer, 11 mils thickness
H5060v1
V
V
SS
DD
Out
Fig. 5
4
HIZ
X=0, Y= 508
X= -160
Y= -159
H5060v2
www.emmicroelectronic.com
EM5060
Fig. 6