SGM2013N Sony Electronics, SGM2013N Datasheet

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SGM2013N

Manufacturer Part Number
SGM2013N
Description
Gaas N-channel Dual-gate Mes Fet
Manufacturer
Sony Electronics
Datasheet
For the availability of this product, please contact the sales office.
Description
MES FET for UHF-band low-noise amplification. This
FET is suitable for a wide range of applications
including cellular/cordless phone.
Features
• Ultra-small package
• Low voltage operation
• Low noise NF = 1.4dB (Typ) at 900MHz, NF = 1.7dB (Typ) at 1.5GHz
• High gain Ga = 18dB (Typ) at 900MHz, Ga = 16dB (Typ) at 1.5GHz
• High stability
• Built-in gate protection diode
Application
Structure
Absolute Maximum Ratings (Ta = 25°C)
• Drain to source voltage
• Gate 1 to source voltage
• Gate 2 to source voltage
• Drain current
• Allowable power dissipation
• Channel temperature
• Storage temperature
The SGM2013N is an N-channel dual-gate GaAs
UHF-band high-frequency amplifier and mixer
GaAs, N-channel, dual-gate metal semiconductor field-effect transistor
Sony reserves the right to change products and specifications without prior notice. This information does not convey any license by
any implication or otherwise under any patents or other right. Application circuits shown, if any, are typical examples illustrating the
operation of the devices. Sony cannot assume responsibility for any problems arising out of the use of these circuits.
GaAs N-channel Dual-Gate MES FET
V
V
V
I
P
Tch
Tstg
D
DSX
G1S
G2S
D
–55 to +150
100
125
–4
–4
18
6
– 1 –
mW
mA
°C
°C
V
V
V
SGM2013N
M-281
E97144-PS

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SGM2013N Summary of contents

Page 1

... GaAs N-channel Dual-Gate MES FET For the availability of this product, please contact the sales office. Description The SGM2013N is an N-channel dual-gate GaAs MES FET for UHF-band low-noise amplification. This FET is suitable for a wide range of applications including cellular/cordless phone. Features • Ultra-small package • ...

Page 2

... 2mA 0.5V G2S f = 900MHz 2V G1S = 0V 12 –0.2V 8 –0.4V 4 –0.6V –0.8V –1. –2.0 V – 2 – SGM2013N (Ta = 25°C) Min. Typ. Max. Unit –4 µA –4 µ –1.5 V –1 0. 1.4 2 ...

Page 3

... V 25 3.0 (V 2.5 20 2.0 15 1.5 10 1 0.2 0.4 – 3 – SGM2013N gm vs. V G1S V G2S = 0.5V 0.25V 0V –0.25V –0.5V –0.75V –1.5 –1.0 –0.5 0 – Gate 1 source voltage [V] G1S NF – Drain to source voltage [ ...

Page 4

... V = 0.5V 2mA) G2S MAG 4.2 85.0 6.1 83.9 8.0 82.9 9.8 81.9 11.5 80.9 13.2 79.9 14.8 79.0 16.4 78.1 18.0 77.2 19.6 76.3 21.1 75.5 22.6 74.7 24.2 74.0 25.8 73.3 27.4 72.6 29.1 71.9 30.8 71.3 32.5 70.7 34.4 70.1 – 4 – SGM2013N = 2mA) D S12 S22 ANG MAG ANG 0.98 87.0 –2.0 85.4 0.98 –3.1 0.98 84.7 –4.0 83.0 0.98 –5.2 0.98 81.9 –6.1 80.3 0.98 –7.2 0.98 78.9 –8.3 77.8 0.98 –9.7 0.97 –10.5 76.9 0.97 75.8 –11.7 0.96 –12.7 75.0 0.96 73.8 –13.8 0.96 –14.8 72.9 0.96 72.8 –15.9 0.96 –16.9 72.5 0.96 71.5 –18.0 70.9 0.95 –19.0 0.95 69.7 –20.0 68.6 0.95 –20.6 ...

Page 5

... Package Outline Unit 0.1 0.3 – 0.05 SONY CODE EIAJ CODE JEDEC CODE M-281 2.0 ± 0.2 1.3 (0.65) (0.65 0.1 0.4 – 0.05 (0.65) (0.6) 1.25 PACKAGE MATERIAL LEAD TREATMENT M-281 LEAD MATERIAL PACKAGE WEIGHT – 5 – SGM2013N 0.9 ± 0.1 0 ± 0.1 + 0.1 0.1 – 0. Source 2 : Gate Gate Drain EPOXY RESIN SOLDER PLATING COPPER 0.1g ...

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